component
NCP3235MNTXG
Public Unreviewedby Ray
onsemi DC-DC Converters, QFN-40-EP(6x6). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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PCB Footprint
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Datasheet
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README
markdownNCP3235MNTXG
onsemi · DC-DC Converters · QFN-40-EP(6x6)
NCP3235MNTXG from onsemi, in a QFN-40-EP(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SS | input | Soft-start pin. A capacitor from this pin to GND allows the user to adjust the soft-start ramp time. |
| 2 | FB | input | Output voltage feedback input to the internal error amplifier (reference 0.6 V). |
| 3 | COMP | output | Output of the internal error amplifier; used for loop compensation. |
| 4 | ISET | input | A resistor from this pin to ground sets the over-current protection (OCP) threshold (RDS(on)/ISET ≈ 108 Ω/A). |
| 5 | AGND | power_in | Analog ground reference for control circuitry. |
| 6 | MODE | input | Mode selection for FCCM mode and automatic CCM/DCM mode, switching frequency, and hiccup/latch protection mode. See table in datasheet. |
| 7 | PG | output | Power good indicator of the output voltage. Open-drain output; connect PG to VDD with an external pull-up resistor. |
| 8 | VIN | power_in | Input power connection to the drain of the internal high-side power NMOS switch. Decouple to ground close to the pin. 4.5 V to 23 V input range. |
| 9 | VIN | power_in | Input power connection to the drain of the internal high-side power NMOS switch. Decouple to ground close to the pin. |
| 10 | VIN | power_in | Input power connection to the drain of the internal high-side power NMOS switch. Decouple to ground close to the pin. |
| 11 | VIN | power_in | Input power connection to the drain of the internal high-side power NMOS switch. Decouple to ground close to the pin. |
| 12 | VIN | power_in | Input power connection to the drain of the internal high-side power NMOS switch. Decouple to ground close to the pin. |
| 13 | VIN | power_in | Input power connection to the drain of the internal high-side power NMOS switch. Decouple to ground close to the pin. |
| 14 | VIN | power_in | Input power connection to the drain of the internal high-side power NMOS switch. Decouple to ground close to the pin. |
| 15 | VSWH | power_out | Switch node - connection of the drain and source of the internal NMOS switches. At switch off, the inductor drives this pin below ground through the body diode and the NMOS conducts with high dv/dt. |
| 16 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 17 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 18 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 19 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 20 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 21 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 22 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 23 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 24 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 25 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 26 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 27 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 28 | PGND | power_in | Power ground reference and high-current return path for the bottom gate driver and low-side NMOS. |
| 29 | VSWH | power_out | Switch node - connection of the drain and source of the internal NMOS switches. |
| 30 | VSWH | power_out | Switch node - connection of the drain and source of the internal NMOS switches. |
| 31 | VSWH | power_out | Switch node - connection of the drain and source of the internal NMOS switches. |
| 32 | VSWH | power_out | Switch node - connection of the drain and source of the internal NMOS switches. |
| 33 | VSWH | power_out | Switch node - connection of the drain and source of the internal NMOS switches. |
| 34 | VSWH | power_out | Switch node - connection of the drain and source of the internal NMOS switches. |
| 35 | VSW | input | IC connection to the switch node between the top MOSFET and bottom MOSFET. Return path of the high-side gate driver. |
| 36 | BST | power_in | Top gate driver input supply; bootstrap capacitor connection between the switch node (VSW) and this pin. |
| 37 | AGND | power_in | Analog ground reference for control circuitry. |
| 38 | VB | power_out | Internal LDO output and supply for the NCP3235 (typ 5.15 V). Connect a minimum 4.7 µF ceramic capacitor from this pin to ground. |
| 39 | VCC | power_in | Input supply for the IC. This pin must be connected to VIN (or an external 5 V rail per Figure 3). |
| 40 | EN | input | Enable logic input. Internal pull-up enables the device automatically; drive high to enable, low to disable. A comparator + precision reference (1.2 V) allows this pin to implement an adjustable UVLO circuit. |
| EP41 | GND | power_in | Exposed pad. Connect GND to a large copper plane at ground potential to improve thermal dissipation. |
| EP42 | VIN | power_in | Exposed pad tied to VIN (drain of internal high-side power NMOS). Connect to a large VIN copper plane for current handling and thermal dissipation. |
| EP43 | VSWH | power_out | Exposed pad tied to the switch node (VSWH). Connect to a large copper plane for current handling and thermal dissipation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | QFN-40-EP(6x6) |
| Category | PMIC |
| Pins | 43 |
Ordering variants
Same part, different packaging or reel option.
NCP3235MNTXG
CAD (KiCad official)
- Symbol:
NCP3235MNTXG - Footprint:
Package_DFN_QFN:QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm - 3D model: QFN-40-EP(6x6) (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (17 pp, sha256
25b7c228692098e7, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).