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Contents

README

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NCP1593AMNTWG

onsemi · DC-DC Converters · DFN-10-EP(3x3)

NCP1593AMNTWG from onsemi, in a DFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connect on the NCP1593A. May be left floating or tied to GND. (On NCP1593B this pin is an additional LX.)
2 LX power_out Switching node - drain of the internal high-side PMOS and low-side NMOS. Connect the output inductor to this pin (tie pins 2 and 3 together).
3 LX power_out Switching node - drain of the internal high-side PMOS and low-side NMOS. Connect the output inductor to this pin (tie pins 2 and 3 together).
4 PG output Power Good - open-drain output from the Power-Good comparator. High-impedance when FB voltage is within regulation (rising threshold 0.54 V typ, falling 0.51 V typ); otherwise pulled low (VRPG ≈ 130 mV at 2.5 mA).
5 EN input Enable input. Logic high (>1.4 V) turns the part on; logic low (<0.4 V) shuts it off. An internal ~1.4 µA pull-up forces the part into the enabled state when the pin is left floating.
6 FB input Feedback input to the error amplifier. Connect a resistor divider from VOUT to this pin to program the regulated output; internal reference VFB ≈ 0.6 V.
7 SS passive Soft-start. An external capacitor to GND sets the soft-start ramp time (charged by ISS ≈ 0.7 µA). Leaving the pin open uses the default 500 µs internal soft-start. (On NCP1593B this pin is NC and must be left floating.)
8 VCCA power_in Analog/internal-bias supply input (called VCC in the pin table, VCCA in the pin-connection diagram and application circuit). Bypass with a 0.1 µF ceramic capacitor to GND and tie directly to VCCP on the board. Range 4.0 V to 5.5 V.
9 VCCP power_in Power-stage supply input for the internal high-side PMOS. Tie to VCCA and bypass with input capacitance. Range 4.0 V to 5.5 V.
10 VCCP power_in Power-stage supply input for the internal high-side PMOS. Tie to VCCA and bypass with input capacitance. Range 4.0 V to 5.5 V.
EP GND power_in Exposed thermal pad - device ground and primary thermal path. Must be soldered to the PCB ground plane for proper electrical and thermal operation.

Key specifications

Parameter Value
Manufacturer onsemi
Package DFN-10-EP(3x3)
Category Power Management (PMIC)
Pins 11

Ordering variants

Same part, different packaging or reel option.

  • NCP1593AMNTWG
  • NCP1593AMNTWGBMNTWG

CAD (KiCad official)

  • Symbol: NCP1593AMNTWG
  • Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • 3D model: DFN-10-EP(3x3) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (14 pp, sha256 e51c579bf424fdbd, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF