MIC4802YME from Microchip Tech, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VIN	power_in	Main input supply pin, 3.0 V to 5.5 V operating range (absolute max +6 V). Connect at least a 2.2 µF (min 1 µF) ceramic bypass capacitor between VIN and GND, placed close to the pin.
2	EN	input	Enable input for the linear LED driver; also serves as the Ultra Fast PWM dimming input (200 Hz-500 kHz, duty cycle down to ~1%). Logic low ≤ 0.2 V, logic high ≥ 1.2 V. Pulling EN low for >40 ms enters low-IQ sleep mode. Do not leave floating.
3	RSET	passive	Peak-current programming pin. An internal 1.27 V reference across an external resistor from RSET to GND sets the nominal maximum WLED current: ILED (mA) ≈ 4920·D / (RSET(kΩ) − 0.280). Example: 6.19 kΩ sets ~830 mA at 100% duty cycle.
4	GND	power_in	Device ground return for the linear driver and control circuitry. Route with low-impedance traces from the input capacitor ground; also tie the exposed pad here.
5	D1	output	LED1 current-sink driver pin (linear driver input for the LED cathode). Connect LED anode to VIN and LED cathode to D1. All four D1 pins (5, 6, 7, 8) must be tied together to share the up-to-800 mA LED current.
6	D1	output	LED1 current-sink driver pin (linear driver input for the LED cathode). Connect LED anode to VIN and LED cathode to D1. All four D1 pins (5, 6, 7, 8) must be tied together to share the LED current.
7	D1	output	LED1 current-sink driver pin (linear driver input for the LED cathode). Connect LED anode to VIN and LED cathode to D1. All four D1 pins (5, 6, 7, 8) must be tied together to share the LED current.
8	D1	output	LED1 current-sink driver pin (linear driver input for the LED cathode). Connect LED anode to VIN and LED cathode to D1. All four D1 pins (5, 6, 7, 8) must be tied together to share the LED current.
EP	EPAD	passive	Exposed heat-sink pad on the underside of the SOIC-8-EP package. Not internally connected to the die, but must be soldered to the PCB ground plane for thermal dissipation (θJA = 41 °C/W).

Key specifications

Parameter	Value
Manufacturer	Microchip Tech
Package	SOIC-8-EP
Category	LED Drivers
Pins	9

Ordering variants

Same part, different packaging or reel option.

MIC4802YME

CAD (KiCad official)

Symbol: MIC4802YME
Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
3D model: SOIC-8-EP (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Microchip Tech datasheet (None pp, sha256 778bda01a3f4b72e, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF