component
MD0100DK6-G
Public Unreviewedby Ray
Microchip Tech Interface - Specialized, DFN-8-EP(4x4). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMD0100DK6-G
Microchip Tech · Interface - Specialized · DFN-8-EP(4x4)
MD0100DK6-G from Microchip Tech, in a DFN-8-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Switch Terminal A1 of channel 1. Bi-directional switch terminal that pairs with B1; small signals pass with R_SW ≈ 15 Ω, and the switch opens when |
| 2 | B1 | passive | Switch Terminal B1 of channel 1. Bi-directional switch terminal paired with A1; forms the second port of the T/R switch for channel 1. |
| 3 | A2 | passive | Switch Terminal A2 of channel 2. Bi-directional switch terminal that pairs with B2; independent second-channel high-voltage protection switch. |
| 4 | B2 | passive | Switch Terminal B2 of channel 2. Bi-directional switch terminal paired with A2; forms the second port of the T/R switch for channel 2. |
| 5 | COM2 | unconnected | Internal common node for channel 2 die. Marked 'Do not connect' in the datasheet - leave floating on the board (also tied internally to Heat Slug 2). |
| 6 | COM2 | unconnected | Internal common node for channel 2 die. Marked 'Do not connect' in the datasheet - leave floating on the board (also tied internally to Heat Slug 2). |
| 7 | COM1 | unconnected | Internal common node for channel 1 die. Marked 'Do not connect' in the datasheet - leave floating on the board (also tied internally to Heat Slug 1). |
| 8 | COM1 | unconnected | Internal common node for channel 1 die. Marked 'Do not connect' in the datasheet - leave floating on the board (also tied internally to Heat Slug 1). |
| EP1 | COM1 | unconnected | Heat Slug 1 (exposed pad for channel 1). Marked 'Do not connect' in the datasheet - leave floating; provides mechanical anchoring and thermal path (θ_JA ≈ 44 °C/W) for channel 1 die. |
| EP2 | COM2 | unconnected | Heat Slug 2 (exposed pad for channel 2). Marked 'Do not connect' in the datasheet - leave floating; provides mechanical anchoring and thermal path for channel 2 die. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | DFN-8-EP(4x4) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 10 |
Ordering variants
Same part, different packaging or reel option.
MD0100DK6-GMD0100DK6-GY6
CAD (KiCad official)
- Symbol:
MD0100DK6-G - Footprint:
Package_DFN_QFN:DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm - 3D model: DFN-8-EP(4x4) (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (16 pp, sha256
02d1cecbc394c3f6, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).