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MCP6002T-I

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by Ray

Microchip Operational Amplifier, SOIC-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

Schematic Symbol

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PCB Footprint

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Datasheet

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Contents

README

markdown

MCP6002T-I

Microchip · Operational Amplifier · SOIC-8

MCP6002T-I from Microchip, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUTA output Analog output of Op Amp A. Low-impedance voltage source; rail-to-rail output swings from VSS+25 mV to VDD-25 mV (typ, RL=10 kΩ, VDD=5.5V). Short-circuit current ±23 mA typ at VDD=5.5V.
2 VINA- input Inverting input of Op Amp A. High-impedance CMOS input (~10^13 Ω) with low bias current (±1 pA typ at +25°C). Common-mode input range VSS-0.3V to VDD+0.3V.
3 VINA+ input Noninverting input of Op Amp A. High-impedance CMOS input with rail-to-rail common-mode range (VSS-0.3V to VDD+0.3V). Input bias current ±1 pA typ at +25°C.
4 VSS power_in Negative power supply / ground. Typically tied to ground in single-supply operation. Supply span VDD-VSS is 1.8V to 6.0V (7.0V absolute max).
5 VINB+ input Noninverting input of Op Amp B. High-impedance CMOS input with rail-to-rail common-mode range. Input bias current ±1 pA typ at +25°C.
6 VINB- input Inverting input of Op Amp B. High-impedance CMOS input (~10^13 Ω) with low bias current (±1 pA typ at +25°C).
7 VOUTB output Analog output of Op Amp B. Low-impedance voltage source; rail-to-rail output swings from VSS+25 mV to VDD-25 mV (typ, RL=10 kΩ, VDD=5.5V).
8 VDD power_in Positive power supply. 1.8V to 6.0V above VSS. Requires a local bypass capacitor (0.01-0.1 µF) within 2 mm and a bulk capacitor (≥1 µF) within 100 mm. Quiescent current 100 µA per amplifier (typ).

Key specifications

Parameter Value
Manufacturer Microchip
Package SOIC-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • MCP6002T-ISN
  • MCP6002T-ISNG
  • MCP6002T-IMS
  • MCP6002T-IP
  • MCP6002T-IMNY

CAD (KiCad official)

  • Symbol: MCP6002T-I
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
mcp6002t-i.step 122 KB You want the bare part, or you mark your own boards.
mcp6002t-i-etched.step 2.0 MB You want the part with MCP6002T-I already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 501 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip datasheet (50 pp, sha256 a9b33cface59f4cd, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF