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LPA2110ASPF

LOWPOWER · Audio Power OpAmps · ESOP-8

LPA2110ASPF from LOWPOWER, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CTRL input Shutdown and Class AB / Class D mode select input. Shutdown: 0-0.6V; Class AB: 0.7-1V; Class D: 1.5V-VDD. Absolute max on this pin is -0.3V to 9V.
2 NC unconnected No connection. Leave floating or tie per PCB convention.
3 IN+ input Positive (non-inverting) analog audio input of the amplifier. AC-coupled through input capacitor Ci (typ. 0.22µF) and series input resistor Ri (typ. 27kΩ). Absolute max -0.3V to 9V.
4 IN- input Negative (inverting) analog audio input of the amplifier. AC-coupled through input capacitor Ci (typ. 0.22µF) and series input resistor Ri (typ. 27kΩ). Absolute max -0.3V to 9V.
5 OUT+ output Positive BTL speaker output. Drives one side of the 4Ω/8Ω load; delivers up to 25W into 4Ω at VDD=14.5V. Route to speaker via optional ferrite bead / LC filter for EMI control.
6 VDD power_in Main supply voltage input, 4V to 15.5V operating range (absolute max 18V). Decouple with 1µF ceramic close to pin plus bulk 100µF (or ≥470µF) electrolytic near the device.
7 GND power_in Signal/analog ground reference. Keep separated from high-current power ground path (thermal pad) to avoid interference; join at a single point.
8 OUT- output Negative BTL speaker output. Drives the opposite side of the 4Ω/8Ω load, 180° out of phase from OUT+. Route to speaker via optional ferrite bead / LC filter for EMI control.
9 Thermal PAD power_in Exposed thermal pad on the underside of the ESOP-8 package. Serves as power ground and primary heat-sink; must be soldered to the PCB copper pour with multiple vias (≥6) for proper thermal performance and reliability.

Key specifications

Parameter Value
Manufacturer LOWPOWER
Package ESOP-8
Category Op-amp/Cmp
Pins 9

Ordering variants

  • LPA2110ASPF

CAD (KiCad official)

  • Symbol: LPA2110ASPF
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: lpa2110aspf-etched.step / lpa2110aspf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lpa2110aspf.step / lpa2110aspf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LOWPOWER datasheet (None pp, sha256 d0ba7197e112dadf, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

Symbol & Footprint

Schematic Symbol

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PCB Footprint

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