LNK302DN-TL
Public Unreviewedby Ray
POWER INTEGRATIONS AC-DC Controllers and Regulators, SOIC-8-150mil. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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README
markdownLNK302DN-TL
POWER INTEGRATIONS · AC-DC Controllers and Regulators · SOIC-8-150mil
LNK302DN-TL from POWER INTEGRATIONS, in a SOIC-8-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BP | passive | BYPASS pin. Connection for the external 0.1 uF bypass capacitor to the internally generated 5.8 V supply. Under-voltage lockout disables the MOSFET when VBP falls below 4.85 V; internal 6.3 V shunt clamp allows external bias to reduce no-load consumption to ~50 mW. |
| 2 | FB | input | FEEDBACK pin. Low-impedance source-follower input with 1.65 V threshold. When feedback current into this pin exceeds 49 uA the MOSFET switching is disabled for that cycle (ON/OFF control). Sampled at the start of each cycle by the oscillator clock. |
| 4 | D | power_in | DRAIN pin. Power MOSFET drain connection, rated 700 V BVDSS. Provides the high-voltage rectified-line input and also supplies internal operating current for startup and steady-state through the internal 5.8 V regulator that charges the BYPASS capacitor. |
| 5 | S | power_in | SOURCE pin. Power MOSFET source connection and ground reference for BYPASS and FEEDBACK pins. Multiple S pins are tied internally and used as thermal path; solder to a copper pour to keep the SOURCE pins below 100 C. |
| 6 | S | power_in | SOURCE pin. Tied internally to the other S pins; MOSFET source and ground reference for BP and FB. Also acts as a heat-sinking pin. |
| 7 | S | power_in | SOURCE pin. Tied internally to the other S pins; MOSFET source and ground reference for BP and FB. Also acts as a heat-sinking pin. |
| 8 | S | power_in | SOURCE pin. Tied internally to the other S pins; MOSFET source and ground reference for BP and FB. Also acts as a heat-sinking pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | POWER INTEGRATIONS |
| Package | SOIC-8-150mil |
| Category | PMIC |
| Pins | 7 |
Ordering variants
Same part, different packaging or reel option.
LNK302DN-TLLNK302DN-TLDGLNK302DN-TLDG-TLLNK302DN-TLPNLNK302DN-TLGNLNK302DN-TLGN-TL
CAD (KiCad official)
- Symbol:
LNK302DN-TL - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-150mil (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
lnk302dn-tl.step |
122 KB | You want the bare part, or you mark your own boards. |
lnk302dn-tl-etched.step |
1.8 MB | You want the part with LNK302DN-TL already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 457 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: POWER INTEGRATIONS datasheet (18 pp, sha256
a8ef42988c440a64, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).