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Contents

README

markdown

LNK302DN-TL

POWER INTEGRATIONS · AC-DC Controllers and Regulators · SOIC-8-150mil

LNK302DN-TL from POWER INTEGRATIONS, in a SOIC-8-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BP passive BYPASS pin. Connection for the external 0.1 uF bypass capacitor to the internally generated 5.8 V supply. Under-voltage lockout disables the MOSFET when VBP falls below 4.85 V; internal 6.3 V shunt clamp allows external bias to reduce no-load consumption to ~50 mW.
2 FB input FEEDBACK pin. Low-impedance source-follower input with 1.65 V threshold. When feedback current into this pin exceeds 49 uA the MOSFET switching is disabled for that cycle (ON/OFF control). Sampled at the start of each cycle by the oscillator clock.
4 D power_in DRAIN pin. Power MOSFET drain connection, rated 700 V BVDSS. Provides the high-voltage rectified-line input and also supplies internal operating current for startup and steady-state through the internal 5.8 V regulator that charges the BYPASS capacitor.
5 S power_in SOURCE pin. Power MOSFET source connection and ground reference for BYPASS and FEEDBACK pins. Multiple S pins are tied internally and used as thermal path; solder to a copper pour to keep the SOURCE pins below 100 C.
6 S power_in SOURCE pin. Tied internally to the other S pins; MOSFET source and ground reference for BP and FB. Also acts as a heat-sinking pin.
7 S power_in SOURCE pin. Tied internally to the other S pins; MOSFET source and ground reference for BP and FB. Also acts as a heat-sinking pin.
8 S power_in SOURCE pin. Tied internally to the other S pins; MOSFET source and ground reference for BP and FB. Also acts as a heat-sinking pin.

Key specifications

Parameter Value
Manufacturer POWER INTEGRATIONS
Package SOIC-8-150mil
Category PMIC
Pins 7

Ordering variants

Same part, different packaging or reel option.

  • LNK302DN-TL
  • LNK302DN-TLDG
  • LNK302DN-TLDG-TL
  • LNK302DN-TLPN
  • LNK302DN-TLGN
  • LNK302DN-TLGN-TL

CAD (KiCad official)

  • Symbol: LNK302DN-TL
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8-150mil (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
lnk302dn-tl.step 122 KB You want the bare part, or you mark your own boards.
lnk302dn-tl-etched.step 1.8 MB You want the part with LNK302DN-TL already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 457 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: POWER INTEGRATIONS datasheet (18 pp, sha256 a8ef42988c440a64, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF