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Contents

README

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LMR23625CFDDAR

Texas Instruments · DC-DC Converters · SO-8-EP

LMR23625CFDDAR from Texas Instruments, in a SO-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW power_out Switching output of the regulator, internally connected to the source of the high-side MOSFET and the drain of the low-side MOSFET. Connect to the power inductor. Rated -1 V to VIN+0.3 V (abs max), -5 V to 42 V for <10-ns transients.
2 BOOT passive Bootstrap capacitor connection for the high-side gate driver. Connect a 100 nF to 470 nF high-quality ceramic capacitor from BOOT to SW. Max BOOT-to-SW voltage 5.5 V.
3 VCC power_out Internal bias LDO output for bypassing. Connect a 2.2-µF, 16-V bypass capacitor from this pin to AGND. Do not load externally and do not short to ground during operation. Max 4.5 V (5.25 V in shutdown).
4 FB input Feedback input to the error amplifier. Connect the midpoint of the output feedback resistor divider to this pin. Reference voltage VREF = 1.0 V (typ). Recommended operating range -0.3 V to 1.2 V.
5 EN/SYNC input Enable input to the regulator; high = ON, low = OFF, may be tied to VIN. Do not float. Also serves as an external clock synchronization input: coupling a positive pulse through a small capacitor synchronizes the internal oscillator. Enable rising threshold 1.55 V (typ); recommended range -5 V to 36 V.
6 AGND power_in Analog ground pin. Ground reference for internal references and control logic. Must be connected to system ground (bond to PGND / PAD on the PCB).
7 VIN power_in Input supply pin. Operating range 4 V to 36 V (abs max 42 V). Requires a low-ESR ceramic input capacitor to PGND placed as close to the pin as possible.
8 PGND power_in Power ground pin, connected internally to the source of the low-side power FET. Connect to system ground and to the ground pins of the input and output capacitors; keep the path to CIN as short as possible.
9 PAD power_in Exposed thermal PowerPAD on the bottom of the package. Low-impedance connection to AGND internally; must be connected to PGND on the PCB and used as the primary heat-sinking path to a ground plane.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SO-8-EP
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • LMR23625CFDDAR
  • LMR23625CFDDARCDDA
  • LMR23625CFDDARCDDAR
  • LMR23625CFDDARCFPDRR
  • LMR23625CFDDARCFPDRRR

CAD (KiCad official)

  • Symbol: LMR23625CFDDAR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8-EP (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (43 pp, sha256 c36797b84ad8701d, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF