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LMR14020SDDAR

Texas Instruments · DC-DC Converters · HSOP-8-EP

LMR14020SDDAR from Texas Instruments, in a HSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT passive Bootstrap capacitor connection for the internal high-side MOSFET gate driver. Connect a high-quality 0.1 µF capacitor from BOOT to SW. Absolute max 49 V to GND, 6.5 V to SW.
2 VIN power_in Power supply input, 4 V to 40 V recommended operating range (44 V abs max). Connect to power supply and place high-frequency bypass capacitor CIN close to the VIN pin with short return to GND.
3 EN input Precision enable input with internal pull-up current source (~1 µA). Pull below 1.2 V (typ threshold) to disable; float or connect to VIN to enable. Can set programmable UVLO with a two-resistor divider from VIN.
4 RT/SYNC bidirectional Resistor timing or external clock synchronization input. In RT mode an external resistor to GND sets the switching frequency (200 kHz-2.5 MHz). When driven above the PLL upper threshold (~1.7 V) the pin auto-switches to SYNC mode and locks the internal PLL to the external clock (250 kHz-2.3 MHz). Max 3.6 V to GND.
5 FB input Feedback input pin. Connect to the output feedback divider to set VOUT; internal reference VFB = 0.750 V (typ). Do not short to ground during operation. Max 7 V to GND.
6 SS passive External soft-start control pin. Connect a capacitor from SS to GND to set the soft-start ramp time; internal charge current ISS ≈ 3 µA.
7 GND power_in System ground return pin. Must be tied to the PCB ground plane along with the thermal pad.
8 SW power_out Switching-node output; internally connected to the drain of the high-side power MOSFET. Connect to the power inductor and to the cathode of the external freewheeling (catch) diode. Rated -1 V to 40 V operating, -3 V to 44 V abs max.
9 Thermal Pad power_in Exposed thermal pad on the underside of the HSOIC-8 (DDA) package. Major heat-dissipation path of the die; must be soldered to the PCB ground plane for both thermal performance and electrical ground.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HSOP-8-EP
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • LMR14020SDDAR

CAD (KiCad official)

  • Symbol: LMR14020SDDAR
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: HSOP-8-EP (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
lmr14020sddar.step 193 KB You want the bare part, or you mark your own boards.
lmr14020sddar-etched.step 2.2 MB You want the part with LMR14020SDDAR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 568 faces against 63 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (31 pp, sha256 f7ba37ee6e000887, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF