LM75AD
Public Unreviewedby Ray
NXP Semicon 118 Temperature and Humidity Sensor, SOIC-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownLM75AD
NXP Semicon 118 · Temperature and Humidity Sensor · SOIC-8
LM75AD from NXP Semicon 118, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SDA | bidirectional | I2C-bus serial bidirectional data line; open-drain. Requires an external pull-up (~10 kΩ) to VCC if the bus does not already provide one. Must not be left floating. |
| 2 | SCL | input | I2C-bus serial clock input, driven by the bus master. Requires an external pull-up (~10 kΩ) to VCC if the bus does not already provide one. Must not be left floating. |
| 3 | OS | output | Overtemperature Shutdown output; open-drain. Asserts when Temp exceeds the programmed Tos limit (comparator or interrupt mode selectable). Needs an external pull-up as large as possible, up to 200 kΩ, to minimize self-heating error. |
| 4 | GND | power_in | Ground reference. Connect to system ground. |
| 5 | A2 | input | User-defined I2C slave address bit 2. Tie to GND for logic 0 or VCC for logic 1; must not be left floating (not internally biased). |
| 6 | A1 | input | User-defined I2C slave address bit 1. Tie to GND for logic 0 or VCC for logic 1; must not be left floating (not internally biased). |
| 7 | A0 | input | User-defined I2C slave address bit 0. Tie to GND for logic 0 or VCC for logic 1; must not be left floating (not internally biased). |
| 8 | VCC | power_in | Positive power supply, 2.8 V to 5.5 V. Bypass to GND with a local decoupling capacitor. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | NXP Semicon 118 |
| Package | SOIC-8 |
| Category | Sensor |
| Pins | 8 |
Ordering variants
Same part, different packaging or reel option.
LM75ADLM75ADP
CAD (KiCad official)
- Symbol:
LM75AD - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
lm75ad.step |
122 KB | You want the bare part, or you mark your own boards. |
lm75ad-etched.step |
1.1 MB | You want the part with LM75AD already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 297 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: NXP Semicon 118 datasheet (24 pp, sha256
fc76b747cd9e78c4, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).