footprint + symbol: give this part its thermal pad. It shipped SOIC-8_3.9x4.9mm_P1.27mm, which has no exposed pad at all - datasheet shows an exposed pad of 2.71 x 3.4 mm; TI's own SO PowerPAD-8 land, the same one eleven other TI DDA parts resolved to from their own datasheets. Swapping the land alone would have left pad 9 floating, so the symbol gets a pin on it and page.json is renumbered from "EP" to match. The 3D body is unchanged: the leads and package outline are identical, only the underside pad is added.
orderable attributes: rebuild .lbr with adom-lbr 2.18.0 so MPN, MANUFACTURER and the distributor part numbers reach <technology> (none matched). The published library carried no attributes at all, so a BOM had nothing to buy from. Distributor PNs matched on exact MPN AND corroborating manufacturer.