component
LM2775DSGR
Public Unreviewedby Ray
Texas Instruments DC-DC Converters, WSON-8-EP(2x2). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM2775DSGR
Texas Instruments · DC-DC Converters · WSON-8-EP(2x2)
LM2775DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PFM | input | PFM mode enable. Logic high (1) allows PFM operation for improved light-load efficiency; logic low (0) forces fixed-frequency PWM. Logic thresholds: VIL ≤ 0.4 V, VIH ≥ 1.2 V (referenced to VIN, max VIN + 0.3 V). |
| 2 | C1- | passive | Flying capacitor negative terminal. Connect a 1 µF ceramic flying capacitor (C1) between C1+ (pin 3) and C1- (pin 2) for the switched-capacitor charge pump. |
| 3 | C1+ | passive | Flying capacitor positive terminal. Connect a 1 µF ceramic flying capacitor (C1) between C1+ (pin 3) and C1- (pin 2) for the switched-capacitor charge pump. |
| 4 | OUTDIS | input | Output disconnect / discharge option. Logic high (1) enables active output discharge (~500 µA typical) during shutdown; logic low (0) leaves the output high-impedance without pull-down during shutdown. Logic thresholds: VIL ≤ 0.4 V, VIH ≥ 1.2 V. |
| 5 | EN | input | Chip enable. Logic high (1) enables the converter; logic low (0) shuts the device down (ISD ≈ 0.7 µA). Logic thresholds: VIL ≤ 0.4 V, VIH ≥ 1.2 V (max VIN + 0.3 V). |
| 6 | VOUT | power_out | Charge-pump output. Regulated 5 V (4.8 V to 5.2 V) at up to 200 mA. Bypass to GND with a 2.2 µF ceramic capacitor. Input current limit ICL ≈ 600 mA. |
| 7 | VIN | power_in | Input voltage supply, 2.7 V to 5.5 V (abs max 6 V). Bypass to GND with a 2.2 µF ceramic capacitor. UVLO rising ≈ 2.6 V, falling ≈ 2.4 V. |
| 8 | GND | power_in | Device ground return. Connect to system ground plane along with the thermal pad. |
| 9 | GND | power_in | Exposed thermal pad on the bottom of the WSON package. Must be connected to GND and to a copper pour for thermal performance (RθJC(bot) ≈ 12.8 °C/W). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | PMIC |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
LM2775DSGRLM2775DSGRDSGT
CAD (KiCad official)
- Symbol:
LM2775DSGR - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (28 pp, sha256
1c2c46d32f10cd73, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).