component
lm2576me-12
Public Unreviewedby Ray
HGSEMI DC-DC Converters, ESOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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README
markdownLM2576ME-12
HGSEMI · DC-DC Converters · ESOP-8
LM2576ME-12 from HGSEMI, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Vin | power_in | Unregulated DC input supply. Operating range 15 V to 40 V for the 12 V fixed-output LM2576-12 (up to 60 V for the LM2576HV-12). Bypass with a 100 µF aluminum electrolytic capacitor placed close to the pin. |
| 2 | Output | output | Switching output pin from the internal 3 A power switch. Connect to the catch (Schottky) diode cathode and to the inductor to the output filter capacitor. VSAT typ. 1.4 V at IOUT = 3 A; must not swing more than 1 V below GND (use a Schottky with Vf < 0.5 V to keep the internal parasitic diode off). |
| 3 | Feedback | input | Regulator feedback input. On the fixed 12 V version this pin ties directly to the +12 V regulated output; the internal divider sets VOUT = 12 V ±4%. Feedback bias current typ. 50 nA. Keep this trace short and away from switching nodes. |
| 4 | ~ON/OFF | input | Active-low TTL shutdown/enable input. Logic low (VIL ≤ 1.0/0.8 V) or ground enables the regulator; logic high (VIH ≥ 2.2/2.4 V, up to VIN) shuts it down, dropping to ~50 µA (200 µA max) standby current. Input current 12 µA typ. at 5 V. Do not leave floating; tie to GND for always-on operation. Absolute range −0.3 V ≤ V ≤ +VIN. |
| 5 | GND | power_in | Device ground. Pins 5, 6, 7, and 8 are all Ground on the SOP-8/ESOP-8 pinout and must be tied together to the ground plane. Provide a single-point (star) return for CIN, COUT, catch diode, and the ~ON/OFF pin. On ESOP-8 also solder the exposed thermal pad to the ground copper for heat sinking. |
| 6 | GND | power_in | Device ground (bonded internally to pins 5, 7, 8). Tie to the ground plane along with the other Ground pins to carry high switching return current and to conduct heat out of the package. |
| 7 | GND | power_in | Device ground (bonded internally to pins 5, 6, 8). Tie to the ground plane along with the other Ground pins to carry high switching return current and to conduct heat out of the package. |
| 8 | GND | power_in | Device ground (bonded internally to pins 5, 6, 7). Tie to the ground plane along with the other Ground pins to carry high switching return current and to conduct heat out of the package. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | ESOP-8 |
| Category | PMIC |
| Pins | 8 |
Ordering variants
LM2576ME-12/TRLM2576ME-12LM2576M-12/TRLM2576ME-12LM2576DQ4-12/TRLM2576ME-12LM2576T-12LM2576ME-12LM2576S-12/TRLM2576ME-12LM2576TB-12
CAD (KiCad official)
- Symbol:
LM2576ME-12 - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (None pp, sha256
eddc94f04fe787be, retrieved 2026-08-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).
Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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