LM22676MRX-ADJ
Public Unreviewedby Ray
Texas Instruments DC-DC Converters, SOIC-8-EP. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownLM22676MRX-ADJ
Texas Instruments · DC-DC Converters · SOIC-8-EP
LM22676MRX-ADJ from Texas Instruments, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BOOT | passive | Bootstrap input. Provides the gate drive voltage for the high-side N-channel MOSFET. Requires an external bootstrap capacitor tied between BOOT and SW; internal boot-strap diode charges it each cycle. |
| 2 | NC | unconnected | Not Connected. Not electrically connected inside the chip; pin does not function as a thermal conductor. May be left floating. |
| 3 | NC | unconnected | Not Connected. Not electrically connected inside the chip; pin does not function as a thermal conductor. May be left floating. |
| 4 | FB | input | Feedback input to the regulator error amplifier. In the ADJ version, tie a resistor divider from VOUT to FB to GND to set output voltage; VFB(typ) = 1.285 V. Absolute max -0.5 V to 7 V. |
| 5 | EN | input | Precision enable input. Used to control regulator start-up and shutdown; VEN threshold typ 1.6 V (falling), hysteresis ~0.6 V. Absolute max -0.5 V to 6 V; input current ~6 µA at 0 V. |
| 6 | GND | power_in | Ground input to regulator; system common. Should be tied to the exposed pad and the board ground plane. |
| 7 | VIN | power_in | Input supply to the regulator. Operating range 4.5 V to 42 V (abs max 43 V to GND). Bypass with a low-ESR ceramic capacitor placed close to the pin. |
| 8 | SW | power_out | Switching output of the regulator. Connects to the external inductor and catch diode of the buck power stage. SW to GND DC rating -5 V to VIN (transient -10 V for ≤50 ns). |
| EP | EP | power_in | Exposed thermal pad on the underside of the SO PowerPAD package. Must be connected to ground and to a copper pour on the PCB for thermal dissipation (θJA ≈ 60 °C/W with 1 sq inch of copper). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8-EP |
| Category | PMIC |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
LM22676MRX-ADJLM22676MRX-ADJTJ
CAD (KiCad official)
- Symbol:
LM22676MRX-ADJ - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: SOIC-8-EP (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
lm22676mrx-adj.step |
125 KB | You want the bare part, or you mark your own boards. |
lm22676mrx-adj-etched.step |
2.4 MB | You want the part with LM22676MRX-ADJ already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 601 faces against 152 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (27 pp, sha256
d53171b6eff70605, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).