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le50cd-tr
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STMicroelectronics Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOIC-8-150mil. Datasheet-verified pinout, KiCad symbol/footprint/3D.
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markdownLE50CD-TR
STMicroelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOIC-8-150mil
LE50CD-TR from STMicroelectronics, in a SOIC-8-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Regulated 5 V output. Typ. 5 V (±2% at 25 °C for the C grade), up to 100 mA. Requires a 2.2 µF output capacitor (ESR 0.1-10 Ω) for loop stability. |
| 2 | GND | power_in | Ground / thermal pad. Pins 2, 3, 6 and 7 are internally fused to the die-attach pad and must be connected to a ground copper area for heatsinking. |
| 3 | GND | power_in | Ground / thermal pad. Internally fused to the die-attach pad; tie to ground copper for heatsinking. |
| 4 | NC | unconnected | Not connected. Leave floating or tie to ground. |
| 5 | INHIBIT | input | TTL-compatible shutdown logic input. VIH ≥ 2 V puts the regulator in ON mode; VIL ≤ 0.8 V forces OFF (standby, IQ ≈ 50 µA). Input current typ. 10 µA at VC = 6 V. If left floating the regulator is ON; when the inhibit function is not used, tie to GND to avoid noise pickup. |
| 6 | GND | power_in | Ground / thermal pad. Internally fused to the die-attach pad; tie to ground copper for heatsinking. |
| 7 | GND | power_in | Ground / thermal pad. Internally fused to the die-attach pad; tie to ground copper for heatsinking. |
| 8 | VIN | power_in | Unregulated supply input. Operating range up to 18 V (absolute max 20 V). Dropout typ. 0.2 V (max 0.4 V at 100 mA). Bypass with 0.1 µF close to the pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SOIC-8-150mil |
| Category | PMIC |
| Pins | 8 |
Ordering variants
LE50CD-TRLE50CD-TRLE33CZ-TRLE50CD-TRLE33CZ-APLE50CD-TRLE33ABZ-AP
CAD (KiCad official)
- Symbol:
LE50CD-TR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-150mil (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (24 pp, sha256
9f9072116adaa7c3, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).