LDC1101DRCR from Texas Instruments, in a VSON-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	SDO/INTB	output	SPI data output / INTB. Connect to MISO of SPI master. When CSB is high, this pin is High-Z. Alternatively, this pin can be configured to function as INTB (interrupt).
2	CLKIN	input	External time-base clock input. Provides the reference clock for the LDC1101's measurement engine.
3	SCLK	input	SPI clock input. Driven by the SPI master to clock data in and out of the device.
4	SDI	input	SPI data input. Connect to MOSI of the SPI master.
5	CSB	input	SPI chip select (active low). Multiple devices can be connected on the same SPI bus, and CSB can be used to uniquely select the desired device. CSB must be toggled for proper device operation.
6	INB	passive	External LC sensor input B. Connects to one terminal of the external LC tank circuit (sensor).
7	INA	passive	External LC sensor input A. Connects to the other terminal of the external LC tank circuit (sensor).
8	GND	power_in	Device ground. Must always be connected to ground.
9	VDD	power_in	Power supply. Operating range 1.71 V to 3.46 V (typical 1.8 V to 3.3 V); absolute maximum 3.6 V.
10	CLDO	power_out	Internal LDO bypassing pin. A 15-nF capacitor must be connected from this pin to GND. Absolute maximum voltage 1.9 V.
DAP	DAP	power_in	Die Attach Pad (exposed thermal pad). Connect to ground for improved thermal performance. There is an internal electrical connection between the DAP and the GND pin. Although the DAP can be left floating, for best performance the DAP must be connected to the same potential as GND. Do not use the DAP as the primary ground for the device.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	VSON-10-EP(3x3)
Category	Sensor
Pins	11

Ordering variants

Same part, different packaging or reel option.

LDC1101DRCR
LDC1101DRCRDRCT

CAD (KiCad official)

Symbol: LDC1101DRCR
Footprint: Package_SON:VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm
3D model: VSON-10-EP(3x3) (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`ldc1101drcr.step`	283 KB	You want the bare part, or you mark your own boards.
`ldc1101drcr-etched.step`	1.8 MB	You want the part with `LDC1101DRCR` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 461 faces against 74 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (58 pp, sha256 6ea695c192091172, retrieved 2026-08-17, tier: manufacturer)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF