ISO7741DBQR from Texas Instruments, in a SSOP-16-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VCC1	power_in	Power supply, side 1. 2.25 V to 5.5 V with respect to GND1. Bypass with a low-ESR ceramic capacitor to GND1.
2	GND1	power_in	Ground reference for VCC1 (side 1). Tied internally to pin 8.
3	INA	input	Input, channel A (side 1). CMOS/LVCMOS logic input referenced to VCC1/GND1; VIH >= 0.7VCC1, VIL <= 0.3VCC1.
4	INB	input	Input, channel B (side 1). CMOS/LVCMOS logic input referenced to VCC1/GND1.
5	INC	input	Input, channel C (side 1). CMOS/LVCMOS logic input referenced to VCC1/GND1.
6	OUTD	output	Output, channel D (side 1, reverse channel). Push-pull CMOS output driven from IND on side 2, referenced to VCC1/GND1. High-Z when EN1 is low.
7	EN1	input	Output enable 1. Output pins on side 1 (OUTD) are enabled when EN1 is high or open; outputs enter high-impedance state when EN1 is low. Internal pull-up.
8	GND1	power_in	Ground reference for VCC1 (side 1). Tied internally to pin 2; both should be connected on the PCB.
9	GND2	power_in	Ground reference for VCC2 (side 2). Tied internally to pin 15.
10	EN2	input	Output enable 2. Output pins on side 2 (OUTA, OUTB, OUTC) are enabled when EN2 is high or open; outputs enter high-impedance state when EN2 is low. Internal pull-up.
11	IND	input	Input, channel D (side 2, reverse channel). CMOS/LVCMOS logic input referenced to VCC2/GND2; drives OUTD on side 1.
12	OUTC	output	Output, channel C (side 2). Push-pull CMOS output driven from INC on side 1, referenced to VCC2/GND2. High-Z when EN2 is low.
13	OUTB	output	Output, channel B (side 2). Push-pull CMOS output driven from INB on side 1, referenced to VCC2/GND2. High-Z when EN2 is low.
14	OUTA	output	Output, channel A (side 2). Push-pull CMOS output driven from INA on side 1, referenced to VCC2/GND2. High-Z when EN2 is low.
15	GND2	power_in	Ground reference for VCC2 (side 2). Tied internally to pin 9; both should be connected on the PCB.
16	VCC2	power_in	Power supply, side 2. 2.25 V to 5.5 V with respect to GND2. Bypass with a low-ESR ceramic capacitor to GND2.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	SSOP-16-150mil
Category	Comm/UART
Pins	16

Ordering variants

Same part, different packaging or reel option.

ISO7741DBQR
ISO7741DBQRDWR
ISO7741DBQRDW

CAD (KiCad official)

Symbol: ISO7741DBQR
Footprint: Package_SO:SSOP-16_5.3x6.2mm_P0.65mm
3D model: SSOP-16-150mil (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`iso7741dbqr.step`	217 KB	You want the bare part, or you mark your own boards.
`iso7741dbqr-etched.step`	2.5 MB	You want the part with `ISO7741DBQR` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 631 faces against 267 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (54 pp, sha256 6d75b03eef5cea97, retrieved 2026-08-17, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF