ISO3088DWR
Public Unreviewedby Ray
Texas Instruments RS-485 / RS-422 ICs, SOIC-16-300mil. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownISO3088DWR
Texas Instruments · RS-485 / RS-422 ICs · SOIC-16-300mil
ISO3088DWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Vcc1 | power_in | Logic-side supply. 3.15-3.6 V for 3.3 V operation, or 4.5-5.5 V for 5 V operation. Referenced to GND1. |
| 2 | GND1 | power_in | Logic-side ground reference for Vcc1. Isolated from GND2 by the galvanic isolation barrier. |
| 3 | R | output | Receiver output (logic side). Driven high/low from the differential bus A-B; high-impedance when RE is high. 3.3 V/5 V CMOS levels. |
| 4 | RE | input | Receiver enable, active LOW. Drive low to enable receiver output R; drive high to place R in high-impedance state. Logic-side CMOS input. |
| 5 | DE | input | Driver enable, active HIGH. Drive high to enable the differential bus driver; drive low to place A/B outputs in high-impedance state. Logic-side CMOS input. |
| 6 | D | input | Driver data input (logic side). Logic level here is transmitted to the differential bus A/B when DE is asserted. 3.3 V/5 V CMOS input, 5 V tolerant. |
| 7 | GND1 | power_in | Logic-side ground. Tie together with pins 2 and 8 to the logic-side ground plane. |
| 8 | GND1 | power_in | Logic-side ground. Tie together with pins 2 and 7 to the logic-side ground plane. |
| 9 | GND2 | power_in | Bus-side ground. Tie together with pins 10 and 15 to the isolated bus-side ground plane. |
| 10 | GND2 | power_in | Bus-side ground. Tie to bus-side ground plane along with pins 9 and 15. |
| 11 | NC | unconnected | No internal connection. Leave floating or tie to GND2. |
| 12 | A | bidirectional | Non-inverting differential bus I/O (RS-485/RS-422). Driver output when DE is high; receiver input at all times. Withstands -7 V to +12 V bus common mode; 12 kV HBM ESD to GND2. |
| 13 | B | bidirectional | Inverting differential bus I/O (RS-485/RS-422). Driver output when DE is high; receiver input at all times. Withstands -7 V to +12 V bus common mode; 12 kV HBM ESD to GND2. |
| 14 | NC | unconnected | No internal connection. Leave floating or tie to GND2. |
| 15 | GND2 | power_in | Bus-side ground. Tie together with pins 9 and 10 to the isolated bus-side ground plane. |
| 16 | Vcc2 | power_in | Bus-side supply, 4.5-5.5 V. Powers the isolated RS-485 line driver/receiver. Referenced to GND2. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Interface |
| Pins | 16 |
Ordering variants
Same part, different packaging or reel option.
ISO3088DWR
CAD (KiCad official)
- Symbol:
ISO3088DWR - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
iso3088dwr.step |
217 KB | You want the bare part, or you mark your own boards. |
iso3088dwr-etched.step |
3.0 MB | You want the part with ISO3088DWR already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 722 faces against 267 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (20 pp, sha256
8979fe1c0e6ee2ce, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).