ISO1050DWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VCC1	power_in	Digital/controller-side supply voltage (3 V to 5.5 V). Powers the logic side (TXD/RXD) of the isolation barrier. Bypass locally to GND1.
2	GND1	power_in	Digital-side ground reference. All logic-side voltages (VCC1, TXD, RXD) are measured with respect to GND1. Tied together with pins 7 and 8.
3	RXD	output	CAN receive data output to the microcontroller. LOW indicates a dominant bus state, HIGH indicates a recessive bus state. Logic-side signal referenced to GND1/VCC1.
4	NC	unconnected	No internal connection. Leave floating or tie as convenient for layout; no electrical function.
5	NC	unconnected	No internal connection. Leave floating or tie as convenient for layout; no electrical function.
6	TXD	input	CAN transmit data input from the microcontroller. LOW drives the bus to a dominant state, HIGH lets the bus return to recessive. Dominant time-out prevents indefinite bus lockout.
7	GND1	power_in	Digital-side ground connection. Tie externally to pins 2 and 8 to form the logic-side ground plane.
8	GND1	power_in	Digital-side ground connection. Tie externally to pins 2 and 7 to form the logic-side ground plane.
9	GND2	power_in	Transceiver/bus-side ground connection. All bus-side voltages (VCC2, CANH, CANL) are measured with respect to GND2. Isolated from GND1 by the SiO2 barrier.
10	GND2	power_in	Transceiver-side ground connection. Tie together with pins 9 and 15 to form the bus-side ground plane.
11	NC	unconnected	No internal connection. Leave floating or tie as convenient for layout; no electrical function.
12	CANL	bidirectional	Low-level CAN bus line. Differential bus I/O tolerating -27 V to +40 V bus faults and -12 V to +12 V common-mode. Pair with CANH through the twisted CAN bus with proper termination.
13	CANH	bidirectional	High-level CAN bus line. Differential bus I/O tolerating -27 V to +40 V bus faults and -12 V to +12 V common-mode. Pair with CANL through the twisted CAN bus with proper termination.
14	NC	unconnected	No internal connection. Leave floating or tie as convenient for layout; no electrical function.
15	GND2	power_in	Transceiver-side ground connection. Tie together with pins 9 and 10 to form the bus-side ground plane.
16	VCC2	power_in	Transceiver/bus-side supply voltage (nominal 5 V, 4.75 V to 5.25 V). Powers the CAN driver/receiver on the isolated side. Bypass locally to GND2.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	SOIC-16-300mil
Category	Interface
Pins	16

Ordering variants

Same part, different packaging or reel option.

ISO1050DWR
ISO1050DWRDUB
ISO1050DWRDUBR

CAD (KiCad official)

Symbol: ISO1050DWR
Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
3D model: SOIC-16-300mil (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`iso1050dwr.step`	217 KB	You want the bare part, or you mark your own boards.
`iso1050dwr-etched.step`	2.6 MB	You want the part with `ISO1050DWR` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 650 faces against 267 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (39 pp, sha256 a0c90f640df4c1aa, retrieved 2026-08-17, tier: manufacturer)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF