ICM-45686 from TDK InvenSense, in a LGA-14(3x2.5). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	AP_SDO/AP_AD0	bidirectional	AP SPI serial data output in 4-wire SPI mode; AP I3C/I2C slave address LSB when using I3C/I2C. Configurable internal pull-up/pull-down (default pull-up enabled); disable internal pull-up when AP interface is active.
2	RESV/AUX1_SDIO/AUX1_SDI/MAS_DA	bidirectional	Multi-function: AUX1 SPI serial data I/O (3-wire) or SDI (4-wire) in Dual Interface OIS mode; I2C master data (MAS_DA) in Dual Interface I2C Master mode; RESV (no connect or tie to VDDIO/GND) in Single Interface mode. Configurable internal pull-up/pull-down (default pull-up enabled).
3	RESV/AUX1_SCLK/MAS_CLK	bidirectional	AUX1 SPI serial clock in Dual Interface OIS mode; I2C master clock (MAS_CLK) in Dual Interface I2C Master mode; RESV (no connect or tie to VDDIO/GND) in Single Interface mode. Configurable internal pull-up/pull-down (default pull-up enabled).
4	INT1/INT	output	Programmable interrupt 1 output; can be configured as push-pull or open-drain. All interrupts can be mapped to pin 4. Configurable internal pull-up/pull-down (default pull-up disabled).
5	VDDIO	power_in	Digital I/O supply voltage. Typical 1.71-3.6 V (1.1 V min when I3C interface is used). Decouple with 0.1 µF (C2) to GND per typical operating circuit.
6	GND	power_in	Power supply ground reference for both analog core (VDD) and digital I/O (VDDIO).
7	RESV	unconnected	Reserved. Leave as No Connect or tie to VDDIO or GND. Configurable internal pull-up/pull-down (default pull-up enabled); if left as NC, keep internal pull-up enabled; if tied to VDDIO/GND, disable internal pull-up.
8	VDD	power_in	Main analog/core power supply voltage. Typical 1.71-3.6 V. Decouple with 0.1 µF (C1) to GND per typical operating circuit.
9	INT2/FSYNC/CLKIN	bidirectional	Programmable interrupt 2 output (push-pull or open-drain); alternatively frame-sync input (FSYNC) or external clock input (CLKIN). If unused, leave NC or tie to VDDIO. Configurable internal pull-up/pull-down (default pull-up enabled).
10	RESV/AUX1_CS	input	AUX1 SPI chip-select input in Dual Interface OIS mode; RESV (no connect or tie to VDDIO/GND) in Single Interface or I2C Master modes. Configurable internal pull-up/pull-down (default pull-up enabled).
11	RESV/AUX1_SDO	output	AUX1 SPI serial data output in Dual Interface OIS 4-wire mode (leave NC if unused); RESV (no connect or tie to VDDIO/GND) in Single Interface or I2C Master modes. Configurable internal pull-up/pull-down (default pull-up enabled).
12	AP_CS	input	AP SPI chip-select input for the host SPI interface; tie to VDDIO if using AP I3C/I2C interface. Configurable internal pull-up/pull-down (default pull-up enabled); disable internal pull-up when AP interface is active.
13	AP_SCL/AP_SCLK	input	AP host serial clock: I3C/I2C serial clock (AP_SCL) or SPI serial clock (AP_SCLK), up to 12.9 MHz I3C, 1 MHz I2C, or 24 MHz SPI. Configurable internal pull-up/pull-down (default pull-up enabled); disable internal pull-up when AP interface is active.
14	AP_SDA/AP_SDIO/AP_SDI	bidirectional	AP host serial data: I3C/I2C serial data (AP_SDA), SPI serial data I/O (AP_SDIO, 3-wire mode), or SPI serial data input (AP_SDI, 4-wire mode). Configurable internal pull-up/pull-down (default pull-up enabled); disable internal pull-up when AP interface is active.

Key specifications

Parameter	Value
Manufacturer	TDK InvenSense
Package	LGA-14(3x2.5)
Category	Sensor
Pins	14

CAD (KiCad official)

Symbol: ICM-45686
Footprint: Package_LGA:Bosch_LGA-14_3x2.5mm_P0.5mm
3D model: LGA-14(3x2.5) (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`icm-45686.step`	118 KB	You want the bare part, or you mark your own boards.
`icm-45686-etched.step`	1.7 MB	You want the part with `ICM-45686` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 440 faces against 78 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: TDK InvenSense datasheet (199 pp, sha256 dbff9a161c741953, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF