Symbol & Footprint

Schematic Symbol

Open full view ↗

PCB Footprint

Open full view ↗
Contents

README

markdown

ICM-20602

TDK InvenSense · Attitude Sensor/Gyroscope · LGA-16(3x3)

ICM-20602 from TDK InvenSense, in a LGA-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDDIO power_in Digital I/O supply voltage. Range 1.71 V to 3.45 V. Bypass with a 10 nF capacitor to GND.
2 SCL/SPC input I2C serial clock (SCL) in I2C mode; SPI serial clock (SPC) in SPI mode. Interface is selected by the CS pin.
3 SDA/SDI bidirectional I2C serial data (SDA) in I2C mode; SPI serial data input (SDI) in SPI mode. Requires external pull-up (e.g. 10 kΩ) when used as I2C.
4 SA0/SDO bidirectional I2C slave address LSB (SA0) in I2C mode; SPI serial data output (SDO) in SPI mode.
5 CS input Chip select and interface mode select. CS = 0 selects SPI mode; CS = 1 selects I2C mode. Tie to VDDIO to force I2C operation.
6 INT output Interrupt digital output, configurable as totem-pole (push-pull) or open-drain in the INT/DRDY Pin Configuration register.
7 RESV unconnected Reserved. Do not connect (leave floating).
8 FSYNC input Frame synchronization digital input (optional). Used for EIS FSYNC support. Connect to GND if unused.
9 RESV passive Reserved. Connect to GND.
10 RESV passive Reserved. Connect to GND.
11 RESV passive Reserved. Connect to GND.
12 RESV passive Reserved. Connect to GND.
13 GND power_in Power supply ground reference. Connect to system ground.
14 REGOUT passive Regulator filter capacitor connection. Bypass to GND with a 0.1 µF X7R capacitor.
15 RESV passive Reserved. Connect to GND.
16 VDD power_in Main power supply. Operating range 1.71 V to 3.45 V. Bypass with 0.1 µF and 2.2 µF X7R capacitors to GND.

Key specifications

Parameter Value
Manufacturer TDK InvenSense
Package LGA-16(3x3)
Category Sensor
Pins 16

Ordering variants

Same part, different packaging or reel option.

  • ICM-20602

CAD (KiCad official)

  • Symbol: ICM-20602
  • Footprint: Package_LGA:LGA-16_3x3mm_P0.5mm
  • 3D model: LGA-16(3x3) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TDK InvenSense datasheet (57 pp, sha256 d3824fac947869c8, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF