HTP4056 from HXY MOSFET, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	TEMP	input	Battery temperature sense input. Connects to an NTC thermistor divider from the battery pack; charging is inhibited when the pin voltage falls outside the VTEMP-L (~45%VCC) to VTEMP-H (~80%VCC) window.
2	PROG	passive	Charge current program pin. An external resistor from PROG to GND sets the constant-current charge level (VPROG ≈ 1.0 V; IBAT = 1000 mA with RPROG = 1.4 kΩ). Can also be used to monitor charge current.
3	GND	power_in	Device ground. Tie to system ground; also connect the exposed thermal pad to GND for optimal thermal performance.
4	VCC	power_in	Charger input supply. Operating range 4.0 V to 6 V (absolute max 8.5 V). Provides current to the internal power PMOSFET that charges the battery on BAT.
5	BAT	power_out	Battery charge output. Connects to the positive terminal of the single-cell Li-ion battery. Regulated float voltage 4.200 V; delivers up to ~1.0 A (ESOP-8) programmable charge current with ≤2 µA leakage when VCC is removed.
6	STDBY	output	Open-drain charge-complete (standby) status indicator. Pulls low when the charge cycle terminates and the part enters standby; high-impedance otherwise. VOL ≤ 0.3 V at 5 mA sink; typically drives an LED to GND through a pull-up.
7	CHRG	output	Open-drain charging status indicator. Pulls low while charging is in progress; high-impedance when charging is complete, in shutdown, or in fault. VOL ≤ 0.3 V at 5 mA sink; typically drives an LED to GND through a pull-up.
8	NC	unconnected	No internal connection. Leave floating or tie to GND.
EP	GND	power_in	Exposed thermal pad on the underside of the ESOP-8 package. Must be soldered to the PCB ground plane for both electrical ground and heat sinking (θJA = 50 °C/W).

Key specifications

Parameter	Value
Manufacturer	HXY MOSFET
Package	ESOP-8
Category	PMIC
Pins	9

CAD (KiCad official)

Symbol: HTP4056
Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
3D model: ESOP-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`htp4056.step`	193 KB	You want the bare part, or you mark your own boards.
`htp4056-etched.step`	1.3 MB	You want the part with `HTP4056` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 333 faces against 63 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: HXY MOSFET datasheet (13 pp, sha256 0e9323593bab6954, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF