Loads on click. Unloads when scrolled away or the tab is hidden.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads when scrolled away or the tab is hidden.

PCB Footprint

Open full view ↗
Loads on click. Unloads when scrolled away or the tab is hidden.
Loads on click. Unloads when scrolled away or the tab is hidden.
Download PDF
Contents

README

markdown

HMC349AMS8GETR

Analog Devices · RF Switches · MSOP-8-EP

HMC349AMS8GETR from Analog Devices, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Positive supply voltage input, 3 V to 5 V (absolute max +7 V). Typical supply current 1.2 mA (3.5 mA max). Bypass capacitors are recommended on this pin to minimize RF coupling.
2 CTRL input Logic control input selecting which RF throw port is connected to RFC when EN is low. CMOS/TTL compatible: VINL = 0 to 0.8 V, VINH = 2 V to VDD. See truth table (Table 4): with EN low, CTRL=high selects RF1↔RFC, CTRL=low selects RF2↔RFC.
3 RFC bidirectional RF common port, dc-coupled and internally matched to 50 Ω over 0.1 GHz to 4 GHz. An external dc blocking capacitor is required. Path is bidirectional; can be used as RF input or output.
4 EN input Logic enable input. CMOS/TTL compatible (VINL ≤ 0.8 V, VINH ≥ 2 V). When EN=low the switch selects RF1 or RF2 per CTRL; when EN=high both RF paths are in isolation (all-off state) and RFC becomes open reflective.
5 RF1 bidirectional RF throw port 1, dc-coupled and internally matched to 50 Ω. Requires an external dc blocking capacitor. Handles up to 33.5 dBm through-path RF input power (VDD = 5 V, TCASE = 85°C).
6 GND power_in Ground. Must be connected to the RF/dc ground plane of the PCB.
7 GND power_in Ground. Must be connected to the RF/dc ground plane of the PCB.
8 RF2 bidirectional RF throw port 2, dc-coupled and internally matched to 50 Ω. Requires an external dc blocking capacitor. Handles up to 33.5 dBm through-path RF input power (VDD = 5 V, TCASE = 85°C).
EPAD EPAD power_in Exposed thermal/RF pad on the package underside. Must be connected to the RF/dc ground plane of the PCB for proper electrical and thermal performance.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package MSOP-8-EP
Category RF And Wireless
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • HMC349AMS8GETR
  • HMC349AMS8GTR

CAD (KiCad official)

  • Symbol: HMC349AMS8GETR
  • Footprint: Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
  • 3D model: MSOP-8-EP (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (10 pp, sha256 5c56c1b00cad6086, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF