component
HMC1118LP3DETR
Public Unreviewedby Ray
Analog Devices RF Switches, LFCSP-16(3x3). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHMC1118LP3DETR
Analog Devices · RF Switches · LFCSP-16(3x3)
HMC1118LP3DETR from Analog Devices, in a LFCSP-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground. Connect to PCB RF/dc ground. |
| 2 | GND | power_in | Ground. Connect to PCB RF/dc ground. |
| 3 | RFC | passive | RF Common Port. DC-coupled and matched to 50 Ω. A DC blocking capacitor is required if the RF line potential is not equal to 0 V dc. |
| 4 | GND | power_in | Ground. Connect to PCB RF/dc ground. |
| 5 | GND | power_in | Ground. Connect to PCB RF/dc ground. |
| 6 | GND | power_in | Ground. Connect to PCB RF/dc ground. |
| 7 | RF2 | passive | RF2 Port. DC-coupled and matched to 50 Ω. A DC blocking capacitor is required if the RF line potential is not equal to 0 V dc. |
| 8 | GND | power_in | Ground. Connect to PCB RF/dc ground. |
| 9 | VSS | power_in | Negative Supply Voltage Pin. Typical -2.5 V (range -2.75 V to -2.25 V). ISS ≈ 0.5 µA typ, 10 µA max. |
| 10 | VCTRL | input | Control Input Pin. Digital logic input (0 V/3.3 V positive control). VIL ≤ 0.8 V, VIH ≥ 2.0 V. Together with LS, selects the RFC→RF1 vs RFC→RF2 signal path per truth table. |
| 11 | LS | input | Logic Select Input Pin. Digital logic input (0 V to VDD). Combined with VCTRL to determine the SPDT switch state (see Table 6 truth table). |
| 12 | VDD | power_in | Positive Supply Voltage Pin. Typical +3.3 V (range 3.0 V to 3.6 V). IDD ≈ 20 µA typ, 200 µA max. |
| 13 | GND | power_in | Ground. Connect to PCB RF/dc ground. |
| 14 | RF1 | passive | RF1 Port. DC-coupled and matched to 50 Ω. A DC blocking capacitor is required if the RF line potential is not equal to 0 V dc. |
| 15 | GND | power_in | Ground. Connect to PCB RF/dc ground. |
| 16 | GND | power_in | Ground. Connect to PCB RF/dc ground. |
| EPAD | EPAD | power_in | Exposed Pad. Must be connected to the RF/dc ground of the PCB. Provides thermal and RF ground path. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | LFCSP-16(3x3) |
| Category | RF And Wireless |
| Pins | 17 |
Ordering variants
Same part, different packaging or reel option.
HMC1118LP3DETR
CAD (KiCad official)
- Symbol:
HMC1118LP3DETR - Footprint:
Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm - 3D model: LFCSP-16(3x3) (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (11 pp, sha256
2abe2aa85e35ac30, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).