HGX3232AEIMT from HGSEMI, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	C1P	passive	Positive terminal of the charge-pump flying capacitor C1 (typ. 0.1 µF) used by the internal doubler that generates VP from VCC.
2	VP	power_out	Regulated positive charge-pump output, nominally +5.5 V (VCC×2 clamped). Bypass to GND with a 0.1 µF ceramic capacitor. Absolute-max +7.0 V.
3	C1N	passive	Negative terminal of the charge-pump flying capacitor C1 (typ. 0.1 µF) for the internal voltage doubler.
4	C2P	passive	Positive terminal of the charge-pump flying capacitor C2 (typ. 0.1 µF) used by the internal inverter that generates VN from VP.
5	C2N	passive	Negative terminal of the charge-pump flying capacitor C2 (typ. 0.1 µF) for the internal voltage inverter.
6	VN	power_out	Regulated negative charge-pump output, nominally −5.5 V. Bypass to GND with a 0.1 µF ceramic capacitor. Absolute-max range −0.7 V to +0.3 V referenced to GND (i.e. always negative in normal operation).
7	T2OUT	output	RS-232 driver 2 output. Swings between VP and VN (typ. ±5 V) to meet EIA/TIA-232 levels. ESD-protected to ±15 kV HBM, ±15 kV IEC61000-4-2 air-gap, ±8 kV IEC61000-4-2 contact.
8	R2IN	input	RS-232 receiver 2 input. Accepts ±20 V (abs-max) RS-232 line levels through an internal 5 kΩ terminating resistor to GND. ±15 kV ESD-protected.
9	R2OUT	output	Receiver 2 CMOS/TTL logic output. Rail-to-rail swing between GND and VCC; drives the host UART RX line.
10	T2IN	input	Driver 2 CMOS/TTL logic input. Inverted by driver 2 and level-shifted onto T2OUT at RS-232 levels. Absolute-max −0.3 V to +6.0 V.
11	T1IN	input	Driver 1 CMOS/TTL logic input. Inverted by driver 1 and level-shifted onto T1OUT at RS-232 levels. Absolute-max −0.3 V to +6.0 V.
12	R1OUT	output	Receiver 1 CMOS/TTL logic output. Rail-to-rail swing between GND and VCC; drives the host UART RX line.
13	R1IN	input	RS-232 receiver 1 input. Accepts ±20 V (abs-max) RS-232 line levels through an internal 5 kΩ terminating resistor to GND. ±15 kV ESD-protected.
14	T1OUT	output	RS-232 driver 1 output. Swings between VP and VN (typ. ±5 V) to meet EIA/TIA-232 levels. ESD-protected to ±15 kV HBM, ±15 kV IEC61000-4-2 air-gap, ±8 kV IEC61000-4-2 contact.
15	GND	power_in	Device ground reference for logic, receivers, and charge-pump reservoir capacitors.
16	VCC	power_in	Main supply, +3 V to +5.5 V (abs-max +6.0 V). Bypass to GND with a 0.1 µF ceramic capacitor close to the pin. Typical ICC is 0.5 mA.

Key specifications

Parameter	Value
Manufacturer	HGSEMI
Package	TSSOP-16
Category	Interface
Pins	16

Ordering variants

Same part, different packaging or reel option.

HGX3232EIMT/TR
HGX3232EIM/TR
HGX3232ECM/TR
HGX3232EIMS/TR
HGX3232ECMS/TR
HGX3232EIN
HGX3232ECN

CAD (KiCad official)

Symbol: HGX3232AEIMT
Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
3D model: TSSOP-16 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: HGSEMI datasheet (20 pp, sha256 49030f2360ade78f, retrieved 2026-08-17, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF