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HGX3085EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

HGX3085EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output. When RE is low, RO is a logic high if (A - B) ≥ -50mV and a logic low if (A - B) ≤ -200mV. RO is high-impedance when the receiver is disabled (RE high) and true fail-safe holds RO high when the differential inputs are open or shorted.
2 RE input Active-low receiver output enable (with hot-swap input structure). RO is enabled when RE is low and high-impedance when RE is high. Driving RE high while DE is low for >700ns places the device in low-power shutdown mode (ISHDN ≈ 0.05µA typ).
3 DE input Active-high driver output enable (with hot-swap input structure). Driver outputs A and B are active when DE is high and high-impedance when DE is low. Holding DE low with RE high enters low-power shutdown mode.
4 DI input Driver data input. With DE high, a logic low on DI forces A/Y low and B/Z high; a logic high on DI forces A/Y high and B/Z low. VIH ≥ 2V, VIL ≤ 0.8V, input current ±1µA.
5 GND power_in Ground reference for the transceiver.
6 A bidirectional Non-inverting receiver input and non-inverting driver output (half-duplex bus line A/Y). Absolute maximum bus voltage -7V to +12V; receiver differential threshold -200mV to -50mV; driver differential output ≥ 2.1V into 54Ω; ±16kV IEC 61000-4-2 ESD protection.
7 B bidirectional Inverting receiver input and inverting driver output (half-duplex bus line B/Z). Absolute maximum bus voltage -7V to +12V; receiver differential threshold -200mV to -50mV; driver differential output ≥ 2.1V into 54Ω; ±16kV IEC 61000-4-2 ESD protection.
8 VCC power_in Positive supply, 4.5V ≤ VCC ≤ 5.5V. Bypass to GND with a 0.1µF ceramic capacitor placed close to the pin.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Ordering variants

  • HGX3085EIM/TR
  • HGX3085EIMECM/TR
  • HGX3085EIMEIN
  • HGX3085EIMECN
  • HGX3085EIMM/TR
  • HGX3085EIMECMM/TR
  • HGX3085EIM8/TR
  • HGX3085EIMECM8/TR
  • HGX3085EIMEIDQ3/TR
  • HGX3085EIMECDQ3/TR
  • HGX3085EIMEIDQ2/TR
  • HGX3085EIMECDQ2/TR

CAD (KiCad official)

  • Symbol: HGX3085EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (None pp, sha256 f6d3ad97a8f240e8, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

Symbol & Footprint

Schematic Symbol

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PCB Footprint

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