component
HG24C08CMM
Public Unreviewedby Ray
HGSEMI EEPROM, MSOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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markdownHG24C08CMM
HGSEMI · EEPROM · MSOP-8
HG24C08CMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection. May be left floating or tied to GND. |
| 2 | NC | unconnected | No internal connection. May be left floating or tied to GND. |
| 3 | E2 | input | Device address input. Hard-wired to VCC or GND to set the E2 address bit for bus multi-drop (up to 8 devices with two device-type identifiers). Internally pulled down to GND when left floating. |
| 4 | GND | power_in | Ground reference for the power supply. Connect to system ground. |
| 5 | SDA | bidirectional | Serial data. Open-drain bidirectional I/O for the 2-wire I2C interface; requires an external pull-up to VCC. Data is transferred MSB-first, latched on rising SCL and driven on falling SCL. |
| 6 | SCL | input | Serial clock input for the 2-wire I2C interface. Supports up to 400 kHz standard and 1 MHz high-speed transfer rates; requires an external pull-up to VCC. |
| 7 | WP | input | Hardware write-protect input. Tie to VCC to make the whole memory array read-only; tie to GND to enable writes. Internally pulled down to GND when left floating. When driven high, only the device address and word address bytes are ACKed; data bytes are NACKed. |
| 8 | VCC | power_in | Device power supply, 1.7 V to 5.5 V. Operation outside this range may produce spurious results and must be avoided. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Memory |
| Pins | 8 |
Ordering variants
Same part, different packaging or reel option.
HG24C08CMMHG24C08CMM/TRHG24C08CNHG24C08CM/TRHG24C08CMT/TRHG24C08CDQ/TRHG24C08CM5/TR
CAD (KiCad official)
- Symbol:
HG24C08CMM - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (25 pp, sha256
90e20e751b466cc6, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).