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GL3224-OIY04
Public Unreviewedby Ray
Genesys Logic USB Converters, QFN-32-EP(5x5). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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PCB Footprint
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Datasheet
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README
markdownGL3224-OIY04
Genesys Logic · USB Converters · QFN-32-EP(5x5)
GL3224-OIY04 from Genesys Logic, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TXN | output | USB 3.1 Gen 1 SuperSpeed differential transmit negative (SSTX-). |
| 2 | TXP | output | USB 3.1 Gen 1 SuperSpeed differential transmit positive (SSTX+). |
| 3 | AVDD12 | power_in | Analog 1.2 V power source for the USB PHY. Supplied from the on-chip 3.3 V→1.2 V regulator; requires local decoupling. |
| 4 | RXN | input | USB 3.1 Gen 1 SuperSpeed differential receive negative (SSRX-). |
| 5 | RXP | input | USB 3.1 Gen 1 SuperSpeed differential receive positive (SSRX+). |
| 6 | X1 | input | 25 MHz crystal input. Connects to one terminal of an external 25 MHz crystal or accepts an external 25 MHz clock. |
| 7 | X2 | bidirectional | 25 MHz crystal output/feedback. Connects to the second terminal of the external 25 MHz crystal. |
| 8 | AVDD33 | power_in | Analog 3.3 V power source for the USB PHY. Decouple locally to GND. |
| 9 | RTERM | passive | USB reference resistor. Sets the USB drive/termination level; tie to GND through a 680 Ω 1% reference resistor (RREF) laid between RTERM and GND. |
| 10 | SPI_MISO | input | SPI interface: master-in / slave-out from the external SPI flash holding firmware. |
| 11 | SPI_MOSI | output | SPI interface: master-out / slave-in to the external SPI flash holding firmware. |
| 12 | SPI_CK | output | SPI interface clock driven to the external SPI flash. |
| 13 | SPI_CS | output | SPI interface chip select (active-low) to the external SPI flash. |
| 14 | LED | output | Memory card access indicator LED driver output. Programmable behavior; can also be repurposed as a read-only status option. |
| 15 | VBUS | power_in | 5 V power source from the USB VBUS rail. Feeds the on-chip 5 V→3.3 V regulator. |
| 16 | DVDD33 | power_in | Digital 3.3 V power source for the core digital I/O. Decouple locally to GND. |
| 17 | DVDD12 | power_in | Digital 1.2 V power source for the core logic. Supplied from the on-chip 3.3 V→1.2 V regulator. |
| 18 | SD_D1 | bidirectional | SD/MMC card data bit 1 (memory card interface). |
| 19 | SD_D0 | bidirectional | SD/MMC card data bit 0 (memory card interface). |
| 20 | SD_CK | output | SD/MMC card clock output driven to the memory card. |
| 21 | SD_CM | bidirectional | SD/MMC card command/response line. Has an internal pull-up when configured as input. |
| 22 | SD_D3 | bidirectional | SD/MMC card data bit 3 (memory card interface). |
| 23 | SD_D2 | bidirectional | SD/MMC card data bit 2 (memory card interface). |
| 24 | VUHSI | power_out | SD 3.0 UHS-I IO pad power rail. Sourced from the GL3224 internal regulator; no external power input is required, only local decoupling. |
| 25 | DVDD33 | power_in | Digital 3.3 V power source (second DVDD33 pin). Tie together with pin 16. |
| 26 | SD_VCC | power_out | SD card VCC output. Driven through the on-chip power MOSFET to supply the SD/MMC card socket. |
| 27 | GND | power_in | Device ground. The exposed die pad on the QFN underside must also be soldered to ground. |
| 28 | SD_WP | input | SD write-protect sense input. 0 = write enable, 1 = write protected. Internal pull-up when input. |
| 29 | SD_CDZ | input | SD card-detect input (active-low). 0 = card inserted, 1 = no card. Internal pull-up when input. |
| 30 | AVDD33 | power_in | Analog 3.3 V power source (second AVDD33 pin). Tie together with pin 8 and decouple locally. |
| 31 | DM | bidirectional | USB 2.0 high-speed / full-speed differential data minus (D-). |
| 32 | DP | bidirectional | USB 2.0 high-speed / full-speed differential data plus (D+). |
| EP | GND | power_in | Exposed die pad on the QFN underside. Must be connected to system ground for electrical return and thermal dissipation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Genesys Logic |
| Package | QFN-32-EP(5x5) |
| Category | Interface |
| Pins | 33 |
Ordering variants
Same part, different packaging or reel option.
GL3224-OIY04OIYXXGL3224-OIY04GL3224-OIY04ONYXX
CAD (KiCad official)
- Symbol:
GL3224-OIY04 - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Genesys Logic datasheet (25 pp, sha256
d31d18e13a3e5160, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).