GD32E230K8T6 from GigaDevice Semicon Beijing, in a LQFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VDD	power_in	Digital positive supply, 1.8 V to 3.6 V. Decouple with a 100 nF ceramic per VDD pin plus a bulk cap.
2	PF0/OSCIN	bidirectional	GPIO PF0 (5 V tolerant). Alternate function I2C0_SDA. Additional function OSCIN (HXTAL crystal input).
3	PF1/OSCOUT	bidirectional	GPIO PF1 (5 V tolerant). Alternate function I2C0_SCL. Additional function OSCOUT (HXTAL crystal output).
4	NRST	bidirectional	Active-low bidirectional reset pin. Internal weak pull-up; can be driven low to reset the MCU, and is driven low by internal reset sources.
5	VDDA	power_in	Analog supply for ADC, comparator and reset block, 1.8 V to 3.6 V. Must be tied to VDD (or filtered from VDD) and decoupled to VSSA/VSS.
6	PA0/WKUP	bidirectional	GPIO PA0. Alternates: USART1_CTS, CMP_OUT, I2C1_SCL. Additional: ADC_IN0, CMP_IM6, RTC_TAMP1, WKUP0 (wakeup from Standby).
7	PA1	bidirectional	GPIO PA1. Alternates: USART1_RTS, EVENTOUT. Additional: ADC_IN1, CMP_IP.
8	PA2	bidirectional	GPIO PA2. Alternates: USART1_TX. Additional: ADC_IN2, CMP_IM7.
9	PA3	bidirectional	GPIO PA3. Alternates: USART1_RX. Additional: ADC_IN3.
10	PA4	bidirectional	GPIO PA4. Alternates: SPI0_NSS, I2S0_WS, USART1_CK, TIMER13_CH0, SPI1_NSS. Additional: ADC_IN4, CMP_IM4.
11	PA5	bidirectional	GPIO PA5. Alternates: SPI0_SCK, I2S0_CK. Additional: ADC_IN5, CMP_IM5.
12	PA6	bidirectional	GPIO PA6. Alternates: SPI0_MISO, I2S0_MCK, TIMER2_CH0, TIMER0_BRKIN, TIMER15_CH0, EVENTOUT, CMP_OUT. Additional: ADC_IN6.
13	PA7	bidirectional	GPIO PA7. Alternates: SPI0_MOSI, I2S0_SD, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0, EVENTOUT. Additional: ADC_IN7.
14	PB0	bidirectional	GPIO PB0. Alternates: TIMER2_CH2, TIMER0_CH1_ON, USART1_RX, EVENTOUT. Additional: ADC_IN8.
15	PB1	bidirectional	GPIO PB1. Alternates: TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON, SPI1_SCK. Additional: ADC_IN9.
16	VSS	power_in	Digital ground, 0 V reference. Tie to system ground plane along with analog VSSA.
17	VDD	power_in	Digital positive supply, 1.8 V to 3.6 V. Decouple with a 100 nF ceramic close to the pin.
18	PA8	bidirectional	GPIO PA8 (5 V tolerant). Alternates: USART0_CK, TIMER0_CH0, CK_OUT, USART1_TX, EVENTOUT.
19	PA9	bidirectional	GPIO PA9 (5 V tolerant). Alternates: USART0_TX, TIMER0_CH1, TIMER14_BRKIN, I2C0_SCL, CK_OUT.
20	PA10	bidirectional	GPIO PA10 (5 V tolerant). Alternates: USART0_RX, TIMER0_CH2, TIMER16_BRKIN, I2C0_SDA.
21	PA11	bidirectional	GPIO PA11 (5 V tolerant). Alternates: USART0_CTS, TIMER0_CH3, CMP_OUT, EVENTOUT, SPI1_IO2, I2C0_SMBA, I2C1_SCL.
22	PA12	bidirectional	GPIO PA12 (5 V tolerant). Alternates: USART0_RTS, TIMER0_ETI, EVENTOUT, SPI1_IO3, I2C0_TXFRAME, I2C1_SDA.
23	PA13/SWDIO	bidirectional	GPIO PA13 (5 V tolerant). Default function is SWDIO (serial-wire debug data). Alternates: IFRP_OUT, SPI1_MISO.
24	PA14/SWCLK	bidirectional	GPIO PA14 (5 V tolerant). Default function is SWCLK (serial-wire debug clock). Alternates: USART1_TX, SPI1_MOSI.
25	PA15	bidirectional	GPIO PA15 (5 V tolerant). Alternates: SPI0_NSS, I2S0_WS, USART1_RX, SPI1_NSS, EVENTOUT.
26	PB3	bidirectional	GPIO PB3 (5 V tolerant). Alternates: SPI0_SCK, I2S0_CK, EVENTOUT.
27	PB4	bidirectional	GPIO PB4 (5 V tolerant). Alternates: SPI0_MISO, I2S0_MCK, TIMER2_CH0, EVENTOUT, I2C0_TXFRAME, TIMER16_BRKIN.
28	PB5	bidirectional	GPIO PB5 (5 V tolerant). Alternates: SPI0_MOSI, I2S0_SD, I2C0_SMBA, TIMER15_BRKIN, TIMER2_CH1. Additional: WKUP5 (wakeup from Standby).
29	PB6	bidirectional	GPIO PB6 (5 V tolerant). Alternates: I2C0_SCL, USART0_TX, TIMER15_CH0_ON.
30	PB7	bidirectional	GPIO PB7 (5 V tolerant). Alternates: I2C0_SDA, USART0_RX, TIMER16_CH0_ON.
31	BOOT0	input	Boot-mode selection input. Sampled at reset to choose between Flash, System memory and SRAM boot sources. Tie low for normal Flash boot.
32	VSS	power_in	Digital ground, 0 V reference.

Key specifications

Parameter	Value
Manufacturer	GigaDevice Semicon Beijing
Package	LQFP-32(7x7)
Category	MCU
Pins	32

Ordering variants

Same part, different packaging or reel option.

GD32E230K8T6K4T6
GD32E230K8T6K6T6
GD32E230K8T6
GD32E230K8T6K4U6
GD32E230K8T6K6U6
GD32E230K8T6K8U6
GD32E230K8T6C4T6
GD32E230K8T6C6T6
GD32E230K8T6C8T6
GD32E230K8T6G4U6
GD32E230K8T6G6U6
GD32E230K8T6G8U6
GD32E230K8T6F4P6
GD32E230K8T6F6P6
GD32E230K8T6F8P6
GD32E230K8T6F4V6
GD32E230K8T6F6V6
GD32E230K8T6F8V6

CAD (KiCad official)

Symbol: GD32E230K8T6
Footprint: Package_QFP:LQFP-32_7x7mm_P0.8mm
3D model: LQFP-32(7x7) (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`gd32e230k8t6.step`	413 KB	You want the bare part, or you mark your own boards.
`gd32e230k8t6-etched.step`	4.0 MB	You want the part with `GD32E230K8T6` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 985 faces against 507 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: GigaDevice Semicon Beijing datasheet (78 pp, sha256 61f9b2a8e15460f6, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF