GD32E230F8P6TR from GigaDevice Semicon Beijing, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	BOOT0	input	Boot mode selection input. Sampled at reset with the nBOOT1 option byte to choose boot source (main Flash, system memory bootloader, or SRAM).
2	PF0/OSCIN/I2C0_SDA	bidirectional	General-purpose I/O PF0, 5 V tolerant. Alternate function I2C0_SDA. Additional function OSCIN (HXTAL crystal input).
3	PF1/OSCOUT/I2C0_SCL	bidirectional	General-purpose I/O PF1, 5 V tolerant. Alternate function I2C0_SCL. Additional function OSCOUT (HXTAL crystal output).
4	NRST	bidirectional	Active-low bidirectional device reset. Driven low internally on any reset source; drive low externally to force a system reset. Internal pull-up per Table 4-23.
5	VDDA	power_in	Analog supply for ADC, comparator and reset block. 1.8-3.6 V, tie to VDD (with local decoupling) even if analog peripherals are unused.
6	PA0/WKUP	bidirectional	GPIO PA0. Alternates: USART0_CTS, USART1_CTS, CMP_OUT, I2C1_SCL. Additional: ADC_IN0, CMP_IM6, RTC_TAMP1, WKUP0 (wakeup from standby).
7	PA1	bidirectional	GPIO PA1. Alternates: USART0_RTS, USART1_RTS, I2C1_SDA, EVENTOUT. Additional: ADC_IN1, CMP_IP.
8	PA2	bidirectional	GPIO PA2. Alternates: USART0_TX, USART1_TX. Additional: ADC_IN2, CMP_IM7.
9	PA3	bidirectional	GPIO PA3. Alternates: USART0_RX, USART1_RX. Additional: ADC_IN3.
10	PA4	bidirectional	GPIO PA4. Alternates: SPI0_NSS, I2S0_WS, USART0_CK, USART1_CK, TIMER13_CH0, SPI1_NSS. Additional: ADC_IN4, CMP_IM4.
11	PA5	bidirectional	GPIO PA5. Alternates: SPI0_SCK, I2S0_CK. Additional: ADC_IN5, CMP_IM5.
12	PA6	bidirectional	GPIO PA6. Alternates: SPI0_MISO, I2S0_MCK, TIMER2_CH0, TIMER0_BRKIN, TIMER15_CH0, EVENTOUT, CMP_OUT. Additional: ADC_IN6.
13	PA7	bidirectional	GPIO PA7. Alternates: SPI0_MOSI, I2S0_SD, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0, EVENTOUT. Additional: ADC_IN7.
14	PB1	bidirectional	GPIO PB1. Alternates: TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON, SPI1_SCK. Additional: ADC_IN9.
15	VSS	power_in	Ground reference for all digital and analog supplies.
16	VDD	power_in	Main digital supply, 1.8-3.6 V. Requires local bulk and per-pin decoupling capacitors to VSS.
17	PA9	bidirectional	GPIO PA9, 5 V tolerant. Alternates: USART0_TX, TIMER0_CH1, I2C0_SCL, CK_OUT.
18	PA10	bidirectional	GPIO PA10, 5 V tolerant. Alternates: USART0_RX, TIMER0_CH2, TIMER16_BRKIN, I2C0_SDA.
19	PA13/SWDIO	bidirectional	GPIO PA13, 5 V tolerant. Default alternate: SWDIO (Serial Wire Debug data). Other alternates: IFRP_OUT, SPI1_MISO. Reset default is SWD, disable in GPIO_AFR before use as GPIO.
20	PA14/SWCLK	bidirectional	GPIO PA14, 5 V tolerant. Default alternate: SWCLK (Serial Wire Debug clock). Other alternates: USART0_TX, USART1_TX, SPI1_MOSI. Reset default is SWD, disable in GPIO_AFR before use as GPIO.

Key specifications

Parameter	Value
Manufacturer	GigaDevice Semicon Beijing
Package	TSSOP-20
Category	MCU
Pins	20

Ordering variants

Same part, different packaging or reel option.

GD32E230F8P6TR
GD32E230F8P6TRF6P6
GD32E230F8P6TRF4P6
GD32E230F8P6TRF8V6
GD32E230F8P6TRF6V6
GD32E230F8P6TRF4V6
GD32E230F8P6TRG8U6
GD32E230F8P6TRG6U6
GD32E230F8P6TRG4U6
GD32E230F8P6TRK8U6
GD32E230F8P6TRK6U6
GD32E230F8P6TRK4U6
GD32E230F8P6TRK8T6
GD32E230F8P6TRK6T6
GD32E230F8P6TRK4T6
GD32E230F8P6TRC8T6
GD32E230F8P6TRC6T6
GD32E230F8P6TRC4T6

CAD (KiCad official)

Symbol: GD32E230F8P6TR
Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
3D model: TSSOP-20 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`gd32e230f8p6tr.step`	267 KB	You want the bare part, or you mark your own boards.
`gd32e230f8p6tr-etched.step`	3.8 MB	You want the part with `GD32E230F8P6TR` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 911 faces against 327 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: GigaDevice Semicon Beijing datasheet (73 pp, sha256 26a0f74cfb3208cf, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF