GD32E230F6P6TR
Public Unreviewedby Ray
GigaDevice Semicon Beijing Microcontrollers (MCU/MPU/SOC), TSSOP-20. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownGD32E230F6P6TR
GigaDevice Semicon Beijing · Microcontrollers (MCU/MPU/SOC) · TSSOP-20
GD32E230F6P6TR from GigaDevice Semicon Beijing, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BOOT0 | input | Boot mode select input sampled at reset. Selects boot-from-main-flash, system-memory (bootloader), or SRAM together with the nBOOT1 option bit. |
| 2 | PF0-OSCIN | bidirectional | General-purpose I/O PF0 (5 V tolerant). Alternate: I2C0_SDA. Additional: OSCIN (HXTAL crystal input). |
| 3 | PF1-OSCOUT | bidirectional | General-purpose I/O PF1 (5 V tolerant). Alternate: I2C0_SCL. Additional: OSCOUT (HXTAL crystal output). |
| 4 | NRST | bidirectional | Active-low device reset. Bidirectional pin driven low internally on any reset source and can be driven low externally to reset the MCU. |
| 5 | VDDA | power_in | Analog supply for the ADC, comparators, reset block, and PLL. Operating range 2.6 V to 3.6 V; must be tied to VDD when analog blocks are used. |
| 6 | PA0-WKUP | bidirectional | General-purpose I/O PA0. Alternates: USART0_CTS/USART1_CTS, CMP_OUT, I2C1_SCL. Additional: ADC_IN0, CMP_IM6, RTC_TAMP1, WKUP0 (wake-up from Standby). |
| 7 | PA1 | bidirectional | General-purpose I/O PA1. Alternates: USART0_RTS/USART1_RTS, I2C1_SDA, EVENTOUT. Additional: ADC_IN1, CMP_IP. |
| 8 | PA2 | bidirectional | General-purpose I/O PA2. Alternates: USART0_TX/USART1_TX. Additional: ADC_IN2, CMP_IM7. |
| 9 | PA3 | bidirectional | General-purpose I/O PA3. Alternates: USART0_RX/USART1_RX. Additional: ADC_IN3. |
| 10 | PA4 | bidirectional | General-purpose I/O PA4. Alternates: SPI0_NSS, I2S0_WS, USART0_CK, USART1_CK, TIMER13_CH0, SPI1_NSS. Additional: ADC_IN4, CMP_IM4. |
| 11 | PA5 | bidirectional | General-purpose I/O PA5. Alternates: SPI0_SCK, I2S0_CK. Additional: ADC_IN5, CMP_IM5. |
| 12 | PA6 | bidirectional | General-purpose I/O PA6. Alternates: SPI0_MISO, I2S0_MCK, TIMER2_CH0, TIMER0_BRKIN, TIMER15_CH0, EVENTOUT, CMP_OUT. Additional: ADC_IN6. |
| 13 | PA7 | bidirectional | General-purpose I/O PA7. Alternates: SPI0_MOSI, I2S0_SD, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0, EVENTOUT. Additional: ADC_IN7. |
| 14 | PB1 | bidirectional | General-purpose I/O PB1. Alternates: TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON, SPI1_SCK. Additional: ADC_IN9. |
| 15 | VSS | power_in | Device ground / digital return (0 V). |
| 16 | VDD | power_in | Main digital supply, 2.6 V to 3.6 V. Powers the digital core, I/O ring, and embedded voltage regulator; decouple locally. |
| 17 | PA9 | bidirectional | General-purpose I/O PA9 (5 V tolerant). Alternates: USART0_TX, TIMER0_CH1, I2C0_SCL, CK_OUT. |
| 18 | PA10 | bidirectional | General-purpose I/O PA10 (5 V tolerant). Alternates: USART0_RX, TIMER0_CH2, TIMER16_BRKIN, I2C0_SDA. |
| 19 | PA13/SWDIO | bidirectional | PA13, default function SWDIO (Serial Wire Debug data). Alternates: IFRP_OUT, SPI1_MISO. 5 V tolerant. |
| 20 | PA14/SWCLK | bidirectional | PA14, default function SWCLK (Serial Wire Debug clock). Alternates: USART0_TX, USART1_TX, SPI1_MOSI. 5 V tolerant. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GigaDevice Semicon Beijing |
| Package | TSSOP-20 |
| Category | MCU |
| Pins | 20 |
Ordering variants
Same part, different packaging or reel option.
GD32E230F6P6TRGD32E230F6P6TRF8P6GD32E230F6P6TRF8P6TRGD32E230F6P6TRF4P6GD32E230F6P6TRF4P6TRGD32E230F6P6TRF6V6GD32E230F6P6TRF6V6TRGD32E230F6P6TRF8V6GD32E230F6P6TRF8V6TRGD32E230F6P6TRF4V6GD32E230F6P6TRF4V6TRGD32E230F6P6TRG6U6GD32E230F6P6TRG8U6GD32E230F6P6TRG4U6GD32E230F6P6TRK6U6GD32E230F6P6TRK8U6GD32E230F6P6TRK4U6GD32E230F6P6TRK6T6GD32E230F6P6TRK8T6GD32E230F6P6TRK4T6GD32E230F6P6TRC6T6GD32E230F6P6TRC8T6GD32E230F6P6TRC4T6
CAD (KiCad official)
- Symbol:
GD32E230F6P6TR - Footprint:
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm - 3D model: TSSOP-20 (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
gd32e230f6p6tr.step |
267 KB | You want the bare part, or you mark your own boards. |
gd32e230f6p6tr-etched.step |
3.7 MB | You want the part with GD32E230F6P6TR already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 896 faces against 327 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GigaDevice Semicon Beijing datasheet (78 pp, sha256
61f9b2a8e15460f6, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).