component
GD32E230F4P6TR
Public Unreviewedby Ray
GigaDevice Semicon Beijing Microcontrollers (MCU/MPU/SOC), TSSOP-20. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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markdownGD32E230F4P6TR
GigaDevice Semicon Beijing · Microcontrollers (MCU/MPU/SOC) · TSSOP-20
GD32E230F4P6TR from GigaDevice Semicon Beijing, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BOOT0 | input | Boot-mode select input, sampled after reset to choose main flash or system memory boot. |
| 2 | PF0/OSCIN | bidirectional | General-purpose I/O port F bit 0 (5 V tolerant). Alternate: I2C0_SDA. Additional: HXTAL oscillator input (OSCIN). |
| 3 | PF1/OSCOUT | bidirectional | General-purpose I/O port F bit 1 (5 V tolerant). Alternate: I2C0_SCL. Additional: HXTAL oscillator output (OSCOUT). |
| 4 | NRST | bidirectional | Bidirectional active-low device reset. Internally pulled up; can be driven low externally to reset the MCU. |
| 5 | VDDA | power_in | Analog supply rail for ADC, comparators and reset block. 2.6 V-3.6 V; must be tied to VDD when analog blocks are used. |
| 6 | PA0-WKUP | bidirectional | GPIO PA0 with wake-up capability. Alternate: USART0_CTS, USART1_CTS, CMP_OUT, I2C1_SCL. Additional: ADC_IN0, CMP_IM6, RTC_TAMP1, WKUP0. |
| 7 | PA1 | bidirectional | GPIO PA1. Alternate: USART0_RTS/DE, USART1_RTS/DE, I2C1_SDA, EVENTOUT. Additional: ADC_IN1, CMP_IP. |
| 8 | PA2 | bidirectional | GPIO PA2. Alternate: USART0_TX, USART1_TX. Additional: ADC_IN2, CMP_IM7. |
| 9 | PA3 | bidirectional | GPIO PA3. Alternate: USART0_RX, USART1_RX. Additional: ADC_IN3. |
| 10 | PA4 | bidirectional | GPIO PA4. Alternate: SPI0_NSS, I2S0_WS, USART0_CK, USART1_CK, TIMER13_CH0, SPI1_NSS. Additional: ADC_IN4, CMP_IM4. |
| 11 | PA5 | bidirectional | GPIO PA5. Alternate: SPI0_SCK, I2S0_CK. Additional: ADC_IN5, CMP_IM5. |
| 12 | PA6 | bidirectional | GPIO PA6. Alternate: SPI0_MISO, I2S0_MCK, TIMER2_CH0, TIMER0_BRKIN, TIMER15_CH0, EVENTOUT, CMP_OUT. Additional: ADC_IN6. |
| 13 | PA7 | bidirectional | GPIO PA7. Alternate: SPI0_MOSI, I2S0_SD, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0, EVENTOUT. Additional: ADC_IN7. |
| 14 | PB1 | bidirectional | GPIO PB1. Alternate: TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON, SPI1_SCK. Additional: ADC_IN9. |
| 15 | VSS | power_in | Digital and analog ground reference (VSS/VSSA are internally shared on this package). |
| 16 | VDD | power_in | Main digital supply, 2.6 V-3.6 V. Requires a 100 nF decoupling capacitor to VSS. |
| 17 | PA9 | bidirectional | GPIO PA9 (5 V tolerant). Alternate: USART0_TX, TIMER0_CH1, I2C0_SCL, CK_OUT. Can be remapped to PA11 via SYSCFG_CFG0. |
| 18 | PA10 | bidirectional | GPIO PA10 (5 V tolerant). Alternate: USART0_RX, TIMER0_CH2, TIMER16_BRKIN, I2C0_SDA. Can be remapped to PA12 via SYSCFG_CFG0. |
| 19 | PA13/SWDIO | bidirectional | GPIO PA13 (5 V tolerant); after reset serves as Serial Wire Debug data (SWDIO). Alternate: SWDIO, IFRP_OUT, SPI1_MISO. |
| 20 | PA14/SWCLK | bidirectional | GPIO PA14 (5 V tolerant); after reset serves as Serial Wire Debug clock (SWCLK). Alternate: USART0_TX, USART1_TX, SWCLK, SPI1_MOSI. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GigaDevice Semicon Beijing |
| Package | TSSOP-20 |
| Category | MCU |
| Pins | 20 |
Ordering variants
Same part, different packaging or reel option.
GD32E230F4P6TRGD32E230F4P6TRF8P6GD32E230F4P6TRF8P6TRGD32E230F4P6TRF4U6GD32E230F4P6TRF4U6TRGD32E230F4P6TRF8U6GD32E230F4P6TRF8U6TRGD32E230F4P6TRG4U6GD32E230F4P6TRG4U6TRGD32E230F4P6TRG8U6GD32E230F4P6TRG8U6TRGD32E230F4P6TRK4U6GD32E230F4P6TRK4U6TRGD32E230F4P6TRK8U6GD32E230F4P6TRK8U6TRGD32E230F4P6TRK4T6GD32E230F4P6TRK4T6TRGD32E230F4P6TRK8T6GD32E230F4P6TRK8T6TRGD32E230F4P6TRC6T6GD32E230F4P6TRC6T6TRGD32E230F4P6TRC8T6GD32E230F4P6TRC8T6TR
CAD (KiCad official)
- Symbol:
GD32E230F4P6TR - Footprint:
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm - 3D model: TSSOP-20 (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GigaDevice Semicon Beijing datasheet (87 pp, sha256
8cbddebbf22a43b3, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).