FR8008GP from FREQCHIP, in a QFN-40(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	DLDO_OUT	power_out	Internal digital LDO regulator output. Decouple to GND; supplies the digital core.
2	RSTN	input	Global active-low chip reset input.
3	VDDIO	power_in	GPIO I/O supply rail.
4	VCC	power_in	Main chip system supply.
5	BSW	power_out	Integrated buck DC-DC switching node output; connect to external inductor.
6	BFB	input	Integrated buck DC-DC feedback input.
7	NC	unconnected	Not connected internally; leave floating or tie to GND.
8	RF	bidirectional	2.4 GHz Bluetooth LE antenna input/output; connect via matching network to a 50 Ω antenna.
9	XO_24M	output	24 MHz crystal oscillator output (drive side).
10	XI_24M	input	24 MHz crystal oscillator input (feedback side).
11	PA7	bidirectional	General-purpose I/O PA7. Muxable to I2C1.DAT, SPIM0.CSN, SPIS.MISO, UCTS0, UTXD1, PWM7, PDM.DAT, CLK.OUT, RS485.EN, I2S.MISO.
12	PA6	bidirectional	General-purpose I/O PA6. Muxable to I2C1.CLK, SPIM0.CLK, SPIS.MOSI, URTS0, URXD1, PWM6, PDM.CLK, ANT.RX, SIROUT, I2S.MOSI.
13	PA5	bidirectional	General-purpose I/O PA5. Muxable to I2C0.DAT, SPIM0.IO3, SPIS.CSN, UTXD0, USBDM, PWM5, PDM.DAT, ANT.TX, SIRIN, I2S.FRM.
14	PA4	bidirectional	General-purpose I/O PA4. Muxable to I2C0.CLK, SPIM0.IO2, SPIS.CLK, URXD0, USBDP, PWM4, PDM.CLK, CLK.OUT, I2S.BCLK.
15	PA3	bidirectional	General-purpose I/O PA3. Muxable to I2C1.DAT, SPIM0.IO1, SPIS.MISO, UCTS0, UTXD1, PWM3, PDM.DAT, WLAN.RX, I2S.MISO.
16	PA2	bidirectional	General-purpose I/O PA2. Muxable to I2C1.CLK, SPIM0.IO0, SPIS.MOSI, URTS0, URXD1, PWM2, PDM.CLK, WLAN.TX, RS485.EN, I2S.MOSI.
17	PA1	bidirectional	General-purpose I/O PA1. Muxable to I2C0.DAT, SPIM0.CSN, SPIS.CSN, UTXD0, USBDM, PWM1, PDM.DAT, BLE.RX, SIROUT, I2S.FRM.
18	PA0	bidirectional	General-purpose I/O PA0. Muxable to I2C0.CLK, SPIM0.CLK, SPIS.CLK, URXD0, USBDP, PWM0, PDM.CLK, BLE.TX, SIRIN, I2S.BCLK.
19	PB7	bidirectional	General-purpose I/O PB7. Muxable to I2C1.DAT, SPIM0.CSN, SPIS.MISO, UCTS0, UTXD1, PWM7, PDM.DAT, CLK.OUT, RS485.EN, I2S.MISO.
20	PB6	bidirectional	General-purpose I/O PB6. Muxable to I2C1.CLK, SPIM0.CLK, SPIS.MOSI, URTS0, URXD1, PWM6, PDM.CLK, ANT.RX, SIROUT, I2S.MOSI.
21	PB5	bidirectional	General-purpose I/O PB5. Muxable to I2C0.DAT, SPIM0.IO3, SPIS.CSN, UTXD0, USBDM, PWM5, PDM.DAT, ANT.TX, SIRIN, I2S.FRM.
22	PB4	bidirectional	General-purpose I/O PB4. Muxable to I2C0.CLK, SPIM0.IO2, SPIS.CLK, URXD0, USBDP, PWM4, PDM.CLK, CLK.OUT, LCD.DCX, I2S.BCLK.
23	PB3	bidirectional	General-purpose I/O PB3. Muxable to I2C1.DAT, SPIM0.IO1, SPIS.MISO, UCTS0, UTXD1, PWM3, PDM.DAT, WLAN.RX, LCD.CSX, BURN.SPIMISO.
24	PB2	bidirectional	General-purpose I/O PB2. Muxable to I2C1.CLK, SPIM0.IO0, SPIS.MOSI, URTS0, URXD1, PWM2, PDM.CLK, WLAN.TX, RS485.EN, BURN.SPIMOSI.
25	PB1	bidirectional	General-purpose I/O PB1. Muxable to I2C0.DAT, SPIM0.CSN, SPIS.CSN, UTXD0, USBDM, PWM1, PDM.DAT, BLE.RX, SIROUT, BURN.SPICSN.
26	PB0	bidirectional	General-purpose I/O PB0. Muxable to I2C0.CLK, SPIM0.CLK, SPIS.CLK, URXD0, USBDP, PWM0, PDM.CLK, BLE.TX, SIRIN, BURN.SPICLK.
27	PC7	bidirectional	General-purpose I/O PC7. Muxable to I2C1.DAT, SPIM1.CSN, SPIS.MISO, UCTS0, UTXD1, PWM7, PDM.DAT, SWDIO, RS485.EN, I2S.MISO.
28	PC6	bidirectional	General-purpose I/O PC6. Muxable to I2C1.CLK, SPIM1.CLK, SPIS.MOSI, URTS0, URXD1, PWM6, PDM.CLK, SWTCK, SIROUT, I2S.MOSI.
29	PE1	bidirectional	General-purpose I/O PE1. Muxable to I2C0.DAT, SPIM1.IO1, SPIS.CSN, UTXD0, UTXD1, PWM1, PDM.DAT, BLE.RX, SIROUT, USBDM.
30	PE0	bidirectional	General-purpose I/O PE0. Muxable to I2C0.CLK, SPIM1.IO0, SPIS.CLK, URXD0, URXD1, PWM0, PDM.CLK, BLE.TX, SIRIN, USBDP.
31	PD7	bidirectional	General-purpose I/O PD7. Muxable to I2C1.DAT, SPIM1.CSN, SPIS.MISO, UCTS0, UTXD1, PWM7, PDM.DAT, SARADC0, RS485.EN, I2S.MISO.
32	PD6	bidirectional	General-purpose I/O PD6. Muxable to I2C1.CLK, SPIM1.CLK, SPIS.MOSI, URTS0, URXD1, PWM6, PDM.CLK, SARADC1, SIROUT, I2S.MOSI.
33	PD5	bidirectional	General-purpose I/O PD5. Muxable to I2C0.DAT, SPIM1.IO3, SPIS.CSN, UTXD0, PWM5, PDM.DAT, SARADC2, SIRIN, I2S.FRM.
34	PD4	bidirectional	General-purpose I/O PD4. Muxable to I2C0.CLK, SPIM1.IO2, SPIS.CLK, URXD0, PWM4, PDM.CLK, SARADC3, I2S.BCLK.
35	PD3	bidirectional	General-purpose I/O PD3. Muxable to I2C1.DAT, SPIM1.IO1, SPIS.MISO, UCTS0, UTXD1, PWM3, PDM.DAT, SARADC4, I2S.MISO.
36	PD2	bidirectional	General-purpose I/O PD2. Muxable to I2C1.CLK, SPIM1.IO0, SPIS.MOSI, URTS0, URXD1, PWM2, PDM.CLK, SARADC5, RS485.EN, I2S.MOSI.
37	PD1	bidirectional	General-purpose I/O PD1. Muxable to I2C0.DAT, SPIM1.CSN, SPIS.CSN, UTXD0, PWM1, PDM.DAT, SARADC6, SIROUT, I2S.FRM.
38	PD0	bidirectional	General-purpose I/O PD0. Muxable to I2C0.CLK, SPIM1.CLK, SPIS.CLK, URXD0, PWM0, PDM.CLK, SARADC7, SIRIN, I2S.BCLK.
39	XO_32K	output	32.768 kHz low-power crystal oscillator output (drive side) for RTC/sleep timing.
40	XI_32K	input	32.768 kHz low-power crystal oscillator input (feedback side) for RTC/sleep timing.
41	GND	power_in	Exposed thermal pad on package bottom. Must be soldered to the PCB ground plane for electrical GND reference and thermal dissipation.

Key specifications

Parameter	Value
Manufacturer	FREQCHIP
Package	QFN-40(5x5)
Category	MCU
Pins	41

Ordering variants

Same part, different packaging or reel option.

FR8008GP
FR8008FP
FR8008HP
FR8008AP
FR8008A
FR8003A
FR8003D

CAD (KiCad official)

Symbol: FR8008GP
Footprint: Package_DFN_QFN:QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm
3D model: QFN-40(5x5) (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`fr8008gp.step`	435 KB	You want the bare part, or you mark your own boards.
`fr8008gp-etched.step`	2.7 MB	You want the part with `FR8008GP` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 658 faces against 254 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: FREQCHIP datasheet (34 pp, sha256 d67fb8edb99c35d3, retrieved 2026-08-17, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF