CSM32RV20
Public Unreviewedby Ray
Nanjing Zhongke Microelectronics Microcontrollers (MCU/MPU/SOC), QFN-32-EP(4x4). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownCSM32RV20
Nanjing Zhongke Microelectronics · Microcontrollers (MCU/MPU/SOC) · QFN-32-EP(4x4)
CSM32RV20 from Nanjing Zhongke Microelectronics, in a QFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PB1 | bidirectional | General-purpose I/O port B bit 1. No dedicated alternate function listed. |
| 2 | PB0 | bidirectional | General-purpose I/O port B bit 0. No dedicated alternate function listed. |
| 3 | PA15 | bidirectional | GPIO PA15. Muxable to TIMER2_CH4N, UART4_TX or EXTI[15]; also provides the RF detection input. |
| 4 | PA14 | bidirectional | GPIO PA14. Muxable to ADC trigger (ADC_TRI), TIMER2_CH4, UART4_RX or EXTI[14]. |
| 5 | PA13 | bidirectional | GPIO PA13. Muxable to TIMER2_CH3N or EXTI[13]; additional function: ADC voltage reference output REFP. |
| 6 | PA12 | bidirectional | GPIO PA12. Muxable to TIMER2_CH3 or EXTI[12]; additional function: PGA input. |
| 7 | PA11 | bidirectional | GPIO PA11. Muxable to TIMER2_BKIN, TIMER2_CH2N, UART3_TX or EXTI[11]; additional function: ADC voltage reference output REFN. |
| 8 | PA10 | bidirectional | GPIO PA10. Muxable to TIMER1_BKIN, TIMER2_CH2, UART3_RX or EXTI[10]; additional function: ADC_IN9. |
| 9 | PA9 | bidirectional | GPIO PA9. Muxable to TIMER1_CH1, UART1_TX, TIMER2_CH1N or EXTI[9]; additional function: ADC_IN8. |
| 10 | PA8 | bidirectional | GPIO PA8. Muxable to I2C SDA, UART1_RX, TIMER2_CH1 or EXTI[8]; additional function: ADC_IN7. |
| 11 | NRST | input | External reset input, active-low. Drive low to reset the MCU. |
| 12 | PA7 | bidirectional | GPIO PA7. Muxable to I2C SCL, SPI MOSI, TIMER1_CH4N or EXTI[7]; additional function: ADC_IN6. |
| 13 | PA6 | bidirectional | GPIO PA6. Muxable to UART1_TX, SPI MISO, TIMER1_CH4 or EXTI[6]; additional function: ADC_IN5. |
| 14 | PA5 | bidirectional | GPIO PA5. Muxable to UART1_RX, SPI SCK, TIMER1_CH3N or EXTI[5]; additional function: ADC_IN4. |
| 15 | PA4 | bidirectional | GPIO PA4. Muxable to SPI MOSI, TIMER1_CH1IN, TIMER1_CH3, UART2_TX or EXTI[4]; additional function: ADC_IN3. |
| 16 | PA3 | bidirectional | GPIO PA3. Muxable to SPI MISO, TIMER1_CH1N, TIMER1_CH2N, UART2_RX or EXTI[3]; additional function: ADC_IN2. |
| 17 | PA2 | bidirectional | GPIO PA2. Muxable to SPI SCK, TIMER1_CH1, TIMER1_CH2 or EXTI[2]. |
| 18 | PA1 | bidirectional | GPIO PA1. Muxable to cJTAG TMSC, I2C SDA, TIMER1_CH1N or EXTI[1]. |
| 19 | PA0 | bidirectional | GPIO PA0. Muxable to cJTAG TCKC, I2C SCL, TIMER1_CH1 or EXTI[0]. |
| 20 | VDD | power_in | Main power supply, 1.8-5.5 V (VDD ≤ 4.8 V for ADC full-scale operation). |
| 21 | PB13 | bidirectional | GPIO PB13; additional function OSC_OUT (external crystal drive output). |
| 22 | PB12 | bidirectional | GPIO PB12; additional function OSC_IN (external crystal input). |
| 23 | PB11 | bidirectional | GPIO PB11; additional function COMP3 negative input (COMP3-). |
| 24 | PB10 | bidirectional | GPIO PB10; additional function COMP3 positive input (COMP3+). |
| 25 | PB9 | bidirectional | GPIO PB9; additional function COMP2 negative input (COMP2-). |
| 26 | PB8 | bidirectional | GPIO PB8; additional function COMP2 positive input (COMP2+). |
| 27 | PB7 | bidirectional | GPIO PB7; additional function COMP1 negative input (COMP1-). |
| 28 | PB6 | bidirectional | GPIO PB6; additional function COMP1 positive input (COMP1+). |
| 29 | PB5 | bidirectional | General-purpose I/O port B bit 5. No dedicated alternate function listed on this variant (E77Q6). On the E77N6 variant this pin is VCAP instead. |
| 30 | PB4 | bidirectional | GPIO PB4; alternate function SPI2_MISO. |
| 31 | PB3 | bidirectional | GPIO PB3; alternate function SPI2_MOSI. |
| 32 | PB2 | bidirectional | GPIO PB2; alternate function SPI2_SCK. |
| 33 | VSS | power_in | Ground. Exposed thermal/ground pad on the bottom of the QFN package; must be soldered to PCB ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nanjing Zhongke Microelectronics |
| Package | QFN-32-EP(4x4) |
| Category | MCU |
| Pins | 33 |
Ordering variants
Same part, different packaging or reel option.
CSM32RV20E77Q6CSM32RV20E77N6
CAD (KiCad official)
- Symbol:
CSM32RV20 - Footprint:
Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm - 3D model: QFN-32-EP(4x4) (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
csm32rv20.step |
76 KB | You want the bare part, or you mark your own boards. |
csm32rv20-etched.step |
1.7 MB | You want the part with CSM32RV20 already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 406 faces against 72 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nanjing Zhongke Microelectronics datasheet (235 pp, sha256
c175e7d3b3828530, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).