BY25Q32ESSIG from BOYAMICRO, in a SOP-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	/CS	input	Chip Select, active-low. Enables the device when driven low, placing it in Active Power mode; when high the device is deselected, all inputs are ignored and outputs go high-impedance (Standby mode). A falling edge is required after power-up before the first instruction.
2	SO/IO1	bidirectional	Serial Data Output in standard SPI (data shifted out on falling edge of SCLK). Becomes bidirectional IO1 during Dual and Quad SPI instructions.
3	/WP/IO2	bidirectional	Write Protect, active-low, in standard/Dual SPI (used with SRP0/SRP1 to hardware-protect the Status Register and protected blocks). Becomes bidirectional IO2 in Quad SPI mode. Has internal pull-up; may be left unconnected if Quad mode not used.
4	VSS	power_in	Ground reference for the VCC supply.
5	SI/IO0	bidirectional	Serial Data Input in standard SPI (data latched on rising edge of SCLK). Becomes bidirectional IO0 during Dual and Quad SPI instructions.
6	SCLK	input	Serial Clock. Provides the synchronization reference for the SPI interface. Instructions, addresses, and input data are latched on the rising edge; output data changes on the falling edge. Supports SPI mode 0 and mode 3.
7	/HOLD/IO3	bidirectional	HOLD (active-low) pauses serial communications without deselecting the device when QE=0; can alternatively be configured as /RESET via Status Register. Becomes bidirectional IO3 in Quad SPI mode. Has internal pull-up; may be left unconnected if Quad mode not used.
8	VCC	power_in	Core and I/O power supply, 2.7 V to 3.6 V single-supply. Must be held stable within the specified range during all operations.

Key specifications

Parameter	Value
Manufacturer	BOYAMICRO
Package	SOP-8-208mil
Category	Memory
Pins	8

Ordering variants

BY25Q32ESSIG
BY25Q32ESSIGBY25Q32ESSJG
BY25Q32ESSIGBY25Q32ESSAG
BY25Q32ESSIGBY25Q32ESSIP
BY25Q32ESSIGBY25Q32ESSIE
BY25Q32ESSIGBY25Q32ESTIG
BY25Q32ESSIGBY25Q32ESTJG
BY25Q32ESSIGBY25Q32ESTAG
BY25Q32ESSIGBY25Q32ESHIG
BY25Q32ESSIGBY25Q32ESHJG
BY25Q32ESSIGBY25Q32ESHAG
BY25Q32ESSIGBY25Q32ESWIG
BY25Q32ESSIGBY25Q32ESWJG
BY25Q32ESSIGBY25Q32ESWAG
BY25Q32ESSIGBY25Q32ESMIG
BY25Q32ESSIGBY25Q32ESMJG
BY25Q32ESSIGBY25Q32ESMAG

CAD (KiCad official)

Symbol: BY25Q32ESSIG
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOP-8-208mil (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`by25q32essig.step`	122 KB	You want the bare part, or you mark your own boards.
`by25q32essig-etched.step`	2.8 MB	You want the part with `BY25Q32ESSIG` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 670 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: BOYAMICRO datasheet (86 pp, sha256 55e80e53231fb096, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF