BQ24092DGQR from Texas Instruments, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	IN	power_in	Input power, connected to external DC supply (AC adapter or USB port). Absolute maximum 12 V; expected 1 µF to 10 µF bypass capacitor from IN to VSS.
2	ISET	input	Programs the fast-charge current. External resistor from ISET to VSS defines fast-charge current (10.8 kΩ = 50 mA to 540 Ω = 1000 mA).
3	VSS	power_in	Ground terminal. Must be tied to the same potential as PRE-TERM, ISET, ISET2, TS, CHG, PG, ASI, ASO reference, and to the exposed thermal pad.
4	PRE-TERM	input	Programs the current termination threshold (5% to 50% of Iout set by ISET) and sets the pre-charge current to twice the termination current. Programming resistor range 1 kΩ to 10 kΩ (2 kΩ ≈ Ipgm/10 for termination; Ipgm/5 for precharge).
5	PG	output	Open-drain Power-Good output. Low (FET on) indicates the input voltage is above UVLO and greater than the OUT (battery) voltage.
6	NC	unconnected	No connect - do not make a connection to this pin (reserved for internal use). Do not route through this pin.
7	ISET2	input	Programs the input/output current limit for the USB or adapter source: High = 500 mA max, Low = value set by ISET, Float = 100 mA max.
8	CHG	output	Open-drain charge status output. Low (FET on) indicates charging; open (FET off) indicates no charging or charge complete. Max sink current 15 mA.
9	TS	input	Temperature-sense input for battery NTC thermistor (10 kΩ for bq24090/2/5, 100 kΩ for bq24091/3 at 25 °C). Floating or pulling High puts part in TTDM Charger mode and disables TS monitoring, timers, and termination. Pulling Low disables the IC. If NTC sensing is not used, tie to VSS via a 10 kΩ/100 kΩ resistor; a 250 kΩ from TS to ground prevents TTDM when the thermistor battery is removed.
10	OUT	power_out	Battery connection; system load may also be connected here. Average load must be low enough to allow the battery to charge within the 10-hour safety timer. Expected 1 µF to 10 µF bypass capacitor. Continuous output current up to 1.25 A absolute max.
PAD	Thermal PAD	power_in	Exposed thermal pad. Internally connected to VSS and must be soldered to the same potential as VSS on the PCB for thermal performance. Do not use the thermal pad as the primary ground input - the VSS pin must be connected to ground at all times.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	MSOP-10-EP
Category	PMIC
Pins	11

Ordering variants

BQ24092DGQR
BQ24092DGQRDGQT

CAD (KiCad official)

Symbol: BQ24092DGQR
Footprint: Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
3D model: MSOP-10-EP (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`bq24092dgqr.step`	151 KB	You want the bare part, or you mark your own boards.
`bq24092dgqr-etched.step`	2.8 MB	You want the part with `BQ24092DGQR` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 669 faces against 182 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (41 pp, sha256 834a24436defa113, retrieved 2026-08-17, tier: manufacturer)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF