BQ24090DGQR from Texas Instruments, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	IN	power_in	Input power from external DC supply (AC adapter or USB port). Absolute max 12 V; recommend 1 µF to 10 µF bypass from IN to VSS.
2	ISET	input	Fast-charge current programming input. External resistor from ISET to VSS sets the fast-charge current, valid range 10.8 kΩ (50 mA) to 540 Ω (1000 mA).
3	VSS	power_in	Ground terminal. Must be tied to system ground and to the exposed thermal pad, which is internally connected to VSS.
4	PRE-TERM	input	Programs the charge termination threshold (5%-50% of IOUT set by ISET) and sets the pre-charge current to 2× the termination current. Programming resistor range 1 kΩ to 10 kΩ (2 kΩ = IPGM/10 for termination; IPGM/5 for pre-charge).
5	PG	output	Open-drain Power-Good status output (active-low). Pulled low (internal FET on) when the input voltage is above UVLO and above the OUT/battery voltage. Requires external pull-up (typ. 2 kΩ shown in datasheet).
6	NC	unconnected	No connect (reserved for internal use). Do not make any external connection and do not route a trace through this pin.
7	ISET2	input	USB/adapter input current-limit select: High = 500 mA max, Low = ISET-programmed current, FLOAT = 100 mA max.
8	CHG	output	Open-drain charge-status output (active-low). Pulled low (internal FET on) while charging and high-Z when charging is complete or absent. Max sink current 15 mA.
9	TS	input	Battery temperature-sense input. Connect through the battery-pack NTC thermistor (10 kΩ NTC @25 °C for bq24090/2/5; 100 kΩ NTC for bq24091/3). Floating or driving TS high forces TTDM Charger mode (disables TS monitoring, timers, termination); pulling low disables the IC. A 250 kΩ from TS to VSS prevents entering TTDM when the thermistor is removed.
10	OUT	power_out	Battery/system-load output. Connect the single-cell Li-Ion/Li-Pol battery here; the system load may be connected in parallel. Recommend 1 µF to 10 µF bypass; continuous current up to 1.25 A absolute max.
PAD	Thermal PAD	power_in	Exposed thermal pad. Internally connected to VSS and must be tied to the same VSS potential on the PCB for grounding and heat sinking. Do not use the pad as the primary ground return.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	MSOP-10-EP
Category	PMIC
Pins	11

Ordering variants

BQ24090DGQR
BQ24090DGQRDGQT

CAD (KiCad official)

Symbol: BQ24090DGQR
Footprint: Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
3D model: MSOP-10-EP (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`bq24090dgqr.step`	151 KB	You want the bare part, or you mark your own boards.
`bq24090dgqr-etched.step`	2.8 MB	You want the part with `BQ24090DGQR` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 679 faces against 182 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (40 pp, sha256 82ee6af1a6387d2c, retrieved 2026-08-17, tier: manufacturer)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF