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Contents

README

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BD9E302EFJ-E2

ROHM · DC-DC Converters · HTSOP-8-EP

BD9E302EFJ-E2 from ROHM, in a HTSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT passive Bootstrap capacitor terminal for high-side MOSFET gate drive. Connect a 0.1 uF ceramic capacitor between BOOT and SW; the capacitor voltage becomes the gate-drive rail for the high-side MOSFET.
2 VIN power_in Power supply input for the switching regulator and internal control circuits. Operating range 7.0 V to 28 V (absolute max +30 V). A 10 uF + 0.1 uF ceramic input capacitor is recommended.
3 EN input Enable input. Low level (<=0.8 V) forces shutdown mode; high level (>=2.5 V) enables the device. Must be driven (not left floating). Typical EN input current 4 uA at VEN=3 V.
4 AGND power_in Analog ground reference for the internal control circuitry. Should be tied to the system ground plane at a low-noise point separate from the switching (PGND) return.
5 FB input Feedback / inverting input to the gm error amplifier. Internal reference is 0.800 V (typ); an external resistor divider from VOUT sets the output voltage. Input current +/-1 uA max.
6 COMP output Error-amplifier output / current-comparator input. Connect an R-C phase-compensation network to AGND here to set the loop response.
7 PGND power_in Power ground return for the output stage (low-side MOSFET source). Carries the switching return current; route as a low-impedance plane to the input capacitor negative terminal.
8 SW power_out Switch node: source of the internal high-side MOSFET and drain of the low-side MOSFET. Connect the power inductor here and the 0.1 uF bootstrap capacitor to BOOT. Rated -0.5 V to VIN+0.3 V.
9 E-Pad power_in Exposed thermal pad on package underside. Solder to the PCB ground plane using multiple thermal vias for heat dissipation; electrically tied to internal ground.

Key specifications

Parameter Value
Manufacturer ROHM
Package HTSOP-8-EP
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • BD9E302EFJ-E2

CAD (KiCad official)

  • Symbol: BD9E302EFJ-E2
  • Footprint: Package_SO:HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm
  • 3D model: HTSOP-8-EP (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM datasheet (43 pp, sha256 d4f722bb50e05130, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF