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BD6586MUV-E2

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by Ray

ROHM Semicon LED Drivers, VQFN-24-EP(4x4). Datasheet-verified pinout, KiCad symbol/footprint/3D.

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Contents

README

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BD6586MUV-E2

ROHM Semicon · LED Drivers · VQFN-24-EP(4x4)

BD6586MUV-E2 from ROHM Semicon, in a VQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Battery/IC power supply input. Recommended operating range 2.7V to 5.5V (absolute max 7V). Bypass with a low-ESR ceramic capacitor near the pin.
2 EN1 input Power control / enable pin 1. Logic input with VthL <= 0.4V and VthH >= 1.4V (max 5.5V), input current ~8.3µA at 2.5V. Used with EN2 and PWM to select which of LED1-4 current drivers are enabled and can be driven with a PWM signal for power-control PWM dimming.
3 EN2 input Power control / enable pin 2. Logic input with VthL <= 0.4V and VthH >= 1.4V (max 5.5V). Combines with EN1/PWM to enable LED current drivers and supports power-control PWM dimming (100Hz-1kHz).
4 GND power_in Analog ground for the DC/DC converter block. Tied together with pins 7 and 10 internally; connect to the ground plane.
5 PWM input PWM dimming input for the current drivers (also acts as an enable). Logic thresholds VthL <= 0.4V, VthH >= 1.4V. Typical PWM frequency 100Hz to 10kHz for current-driver PWM control.
6 ISET input LED current programming pin. Connect a resistor (RISET) to GND to set nominal LED current: Inormal = 20mA x (24kΩ/RISET). ISET voltage typically 0.6V; do not add capacitance (may oscillate).
7 GND power_in Ground return for the ISET resistor. Route RISET's ground leg directly to this pin to preserve current-set accuracy.
8 LED1 input Current sink for LED string 1 (channel 1). Regulated to VLED = 0.5V typ. Maximum 25mA per channel; LED terminal over-voltage protection at 11.5V typ. Absolute max 25V. Leave OPEN if unused.
9 LED2 input Current sink for LED string 2. Same specifications as LED1 (VLED = 0.5V typ, 25mA max, 11.5V LED OVP, 25V abs max).
10 GND power_in Ground for the current-driver block. Internally connected to pins 4 and 7.
11 LED3 input Current sink for LED string 3. Same specifications as LED1 (VLED = 0.5V typ, 25mA max, 11.5V LED OVP, 25V abs max).
12 LED4 input Current sink for LED string 4. Same specifications as LED1 (VLED = 0.5V typ, 25mA max, 11.5V LED OVP, 25V abs max).
13 TEST input Factory test input, pulled down internally with 100kΩ to GND. Leave open or tie to GND in application.
14 TESTO output Factory test output. Leave unconnected in application.
15 NC unconnected No connect. Leave floating or tie to GND.
16 SW output Drain of the integrated 28V N-channel switching MOSFET (boost switch node). Absolute max 30.5V. RDS(on) ~0.24Ω typ at Isw = 100mA. Pins 16, 17, 18 are ganged internally; tie to the inductor/SBD anode node.
17 SW output Boost switch node (paralleled with pins 16 and 18) to lower conduction resistance and improve heat dissipation.
18 SW output Boost switch node (paralleled with pins 16 and 17).
19 VDET input Boost output sense input for external SBD-open detect and output over-voltage protection. SBD-open triggers when VDET < 0.1V; OVP set at 25.5V typ (25.0-26.0V). Absolute max 50.5V.
20 NC unconnected No connect. Leave floating or tie to GND.
21 PGND power_in Power ground / source return for the integrated switching MOSFET. Route directly to input/output capacitor grounds; separated from analog GND inside the IC.
22 PGND power_in Power ground / source return for the integrated switching MOSFET (paralleled with pin 21).
23 NC unconnected No connect. Leave floating or tie to GND.
24 TRSW output Internal switching-MOSFET gate node. A capacitor to PGND may be connected here to soften the SW slew rate and reduce switching noise at the cost of efficiency.
EP GND power_in Exposed thermal pad on the package underside. Must be connected to GND for both thermal dissipation and electrical grounding.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package VQFN-24-EP(4x4)
Category LED Drivers
Pins 25

Ordering variants

Same part, different packaging or reel option.

  • BD6586MUV-E2

CAD (KiCad official)

  • Symbol: BD6586MUV-E2
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
  • 3D model: VQFN-24-EP(4x4) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (None pp, sha256 788a6aa7f1f338c9, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF