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ap7361c-18sp-13
Public Unreviewedby Ray
Diodes Incorporated Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOIC-8-EP. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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README
markdownAP7361C-18SP-13
Diodes Incorporated · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOIC-8-EP
AP7361C-18SP-13 from Diodes Incorporated, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulator output, 1.8V fixed. Bypass to ground with at least 2.2µF ceramic capacitor; a larger capacitor improves AC load response. Delivers up to 1A output current with 1.5A typical current limit and fold-back short-circuit protection (~400mA into hard short). |
| 2 | EN | input | Enable input, active high. VIL ≤ 0.3V (off), VIH ≥ 1.0V up to VIN (on). Internal ~3.0MΩ pull-down keeps the regulator off when the pin floats; input leakage ±0.1µA typ at VIN=5.5V. |
| 3 | NC | unconnected | No internal connection. Leave floating or tie to ground; not required for operation. |
| 4 | GND | power_in | Device ground return. Connect to the system ground plane; on SO-8EP the exposed thermal pad should also be tied to this net to meet the 100°C/W θJA rating. |
| 5 | NC | unconnected | No internal connection. Leave floating or tie to ground; not required for operation. |
| 6 | NC | unconnected | No internal connection. Leave floating or tie to ground; not required for operation. |
| 7 | NC | unconnected | No internal connection. Leave floating or tie to ground; not required for operation. |
| 8 | IN | power_in | Regulator input supply, 2.2V-6.0V (6.5V absolute max). Bypass to ground with at least 1µF ceramic capacitor close to the pin; 4.7µF recommended for the typical application circuit. |
| 9 | EP | passive | Exposed thermal pad on the underside of the SO-8EP package. Solder to a copper ground pour with thermal vias to achieve the 100°C/W θJA rating; electrically tie to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOIC-8-EP |
| Category | PMIC |
| Pins | 9 |
Ordering variants
AP7361C-18SP-13AP7361C-18SP-13SPRAP7361C-18SP-13FGEAP7361C-18SP-13Y5AP7361C-18SP-13DAP7361C-18SP-13DRAP7361C-18SP-13EAP7361C-18SP-13ER
CAD (KiCad official)
- Symbol:
AP7361C-18SP-13 - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: SOIC-8-EP (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (None pp, sha256
9b64f49c5975b2ba, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).