AP2007SPER from Wuxi Chipown Micro electronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	LX	passive	Inductor switching node. Connects to one end of the boost inductor (3.3µH typical); tied together with pin 2 internally. Absolute maximum rating -0.3V to +6V. Switches at 1MHz with typical RDS(on) of 52mΩ (NMOS) / 49mΩ (PMOS) and 5A peak current limit.
2	LX	passive	Inductor switching node (paralleled with pin 1). Connects to one end of the boost inductor. Absolute maximum rating -0.3V to +6V.
3	VIN	power_in	IC power supply input. Operating input voltage range 2.5V to 5V; absolute maximum -0.3V to +6V. Bypass with ~22µF ceramic capacitor close to the pin.
4	EN	input	Enable input for the IC. Drive high (VIH ≥ 1.5V) to enable, low (VIL ≤ 0.5V) to disable. Internal pull-down resistor typ 250kΩ (200-300kΩ) to GND. Absolute maximum -0.3V to +6V. Shutdown current <1µA when EN=0.
5	GND	power_in	IC analog ground. Must be tied to the exposed pad at a single star-ground point.
6	FB	input	Converter feedback input. Regulated to VFB = 1.227V typ (1.208-1.246V). Input bias current 100nA max. Output voltage set by external divider: R1 = R2 × (VOUT/VFB − 1). Absolute maximum -0.3V to +6V.
7	VOUT	power_out	Converter output. Regulated boost output (5V typical, adjustable via FB divider). Paralleled with pin 8; bypass with ~22µF×3 ceramic capacitors. Absolute maximum -0.3V to +6V. Leakage <5µA in shutdown.
8	VOUT	power_out	Converter output (paralleled with pin 7). Absolute maximum -0.3V to +6V.
EP	EP	power_in	Exposed pad on package underside. Internally connected to GND. Must be soldered to the ground plane at a single star-ground point to optimize thermal performance (θJA = 50°C/W, θJC = 10°C/W).

Key specifications

Parameter	Value
Manufacturer	Wuxi Chipown Micro electronics
Package	ESOP-8
Category	PMIC
Pins	9

Ordering variants

AP2007SPER

CAD (KiCad official)

Symbol: AP2007SPER
Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
3D model: ESOP-8 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Wuxi Chipown Micro electronics datasheet (7 pp, sha256 6ccd9a511d12a106, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF