component
AP1510SG-13
Public Unreviewedby Ray
Diodes Incorporated DC-DC Converters, SO-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAP1510SG-13
Diodes Incorporated · DC-DC Converters · SO-8
AP1510SG-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | FB | input | Feedback pin. Connects to the resistor divider that sets the output voltage per VOUT = VFB x (1 + RA/RB), with internal reference VFB = 0.8V (typ). Feedback bias current is 0.1uA typical. |
| 2 | EN | input | Enable input pin. Drive high (VIH >= 2.0V) for normal step-down operation; drive low (VIL <= 0.8V) to stop step-down operation and deactivate all internal circuits. Input leakage +/-20uA typical. |
| 3 | OCSET | input | Over-current set pin. An external resistor from VCC to OCSET, with the internal 90uA (typ) sink current, sets the peak-current limit threshold via IPEAK x RDS(ON) = IOCSET x ROCSET. |
| 4 | VCC | power_in | IC power supply pin. Input voltage range 3.6V to 23V (abs max VSS-0.3 to VSS+25V). UVLO turns the high-side driver off below 3.3V and resumes above 3.5V. |
| 5 | Output | output | Switch node output. Connect external inductor and freewheeling Schottky diode here. Pins 5 and 6 are internally tied together and connected to the die pad for thermal dissipation; minimize trace area to reduce EMI. |
| 6 | Output | output | Switch node output (paralleled with pin 5). Connect external inductor and freewheeling Schottky diode here. Internally tied to pin 5 and the die pad for thermal dissipation. |
| 7 | VSS | power_in | Ground pin. Pins 7 and 8 are internally tied together and connected to the die pad for thermal dissipation; use a solid ground plane for best performance. |
| 8 | VSS | power_in | Ground pin (paralleled with pin 7). Internally tied to pin 7 and the die pad for thermal dissipation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SO-8 |
| Category | PMIC |
| Pins | 8 |
Ordering variants
Same part, different packaging or reel option.
AP1510SG-13
CAD (KiCad official)
- Symbol:
AP1510SG-13 - Footprint:
Package_SO:TI_SO-PowerPAD-8 - 3D model: SO-8 (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (9 pp, sha256
e35449a0805a6cfb, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).