VL53L8CX -- 8x8 Multizone Time-of-Flight Sensor

{
  "schema_version": 1,
  "type": "component",
  "slug": "vl53l8cx",
  "title": "VL53L8CX -- 8x8 Multizone Time-of-Flight Sensor",
  "brief": "STMicroelectronics VL53L8CX. 8x8 multizone ToF ranging sensor, 400cm range, 65-degree FoV, I2C/SPI, 940nm VCSEL. Standardized datasheet with 21 extracted diagrams.",
  "version": "1.0.0",
  "tags": [],
  "license": "MIT",
  "component": {
    "mpn": "VL53L8CX -- 8x8 Multizone Time-of-Flight Sensor",
    "manufacturer": "",
    "package": "",
    "pin_count": null,
    "category": "datasheet",
    "subcategory": "",
    "body_size": null,
    "parts": {},
    "distributor_links": {}
  },
  "readme": "**Source:** [STMicroelectronics Datasheet (DS14161)](https://www.st.com/resource/en/datasheet/vl53l8cx.pdf)\n**Manufacturer:** STMicroelectronics\n**Part Number:** VL53L8CX\n**Document:** DS14161 -- Rev 7, August 2023\n\n## Description\n\nThe VL53L8CX is an 8x8 multizone Time-of-Flight (ToF) ranging sensor with low-power operation and enhanced distance ranging performance under ambient light. Based on STMicroelectronics' FlightSense technology, the sensor provides accurate ranging up to 400 cm with a 65-degree diagonal field of view.\n\nThe VL53L8CX integrates a new-generation VCSEL and two advanced metasurface lenses in an innovative \"all in one\" module. This enables high-performance use cases including low-power system activation, gesture recognition, SLAM for robotics, liquid level monitoring, and more.\n\nThanks to patented algorithms, the VL53L8CX can detect and track multiple targets within the FoV with a 64-zone depth measurement. STMicroelectronics' histograms ensure cover glass crosstalk immunity above 60 cm.\n\nThe VCSEL emits fully invisible 940 nm IR light with Class 1 laser safety certification (IEC 60825-1:2014). The sensor supports both SPI and I2C interfaces for high frequency frame rates and short boot times.\n\n## Key Specifications\n\n| Parameter | Value |\n| --- | --- |\n| Package | Optical LGA16 |\n| Size | 6.4 x 3.0 x 1.75 mm |\n| Ranging Distance | 2 to 400 cm per zone |\n| AVDD Supply | 3.3 V |\n| Core Supply (CORE_1V8) | 1.8 V |\n| IOVDD Supply | 1.2 V or 1.8 V |\n| Operating Temperature | -30 to 85 C |\n| Sample Rate | Up to 60 Hz |\n| Infrared Emitter | 940 nm VCSEL |\n| I2C Interface | 1 MHz, address 0x52 |\n| SPI Interface | Up to 3 MHz |\n| Field of View (diagonal) | 65 degrees |\n| Zone Resolution | 4x4 (16 zones) or 8x8 (64 zones) |\n| Pin Count | 16 (LGA) |\n| Typical Power (continuous) | 215 mW |\n| Typical Power (autonomous, 1 Hz 4x4) | 1.6 mW |\n| Laser Safety | Class 1 (IEC 60825-1:2014) |\n\n## Features\n\n- Multizone distance measurement with either 4x4 or 8x8 separate zones\n- Autonomous low-power mode with interrupt programmable threshold to wake up the host\n- Ranging up to 400 cm with enhanced performance under ambient light\n- Multitarget detection and distance measurement in each zone\n- Histogram processing and algorithmic compensation to minimize cover glass crosstalk\n- Motion indicator for each zone showing if targets have moved and how\n- Frame rate capability of 60 Hz\n- New generation high-power 940 nm invisible light VCSEL with integrated analog driver\n- 65-degree diagonal square FoV using DOEs on both transmitter and receiver\n- Receiving array of SPADs (single photon avalanche diodes)\n- Low-power microcontroller running firmware\n- Single reflowable component with no additional optics required\n- I2C (up to 1 MHz) or SPI (up to 3 MHz) interface\n- Compatible with wide range of cover glass materials, can be hidden behind dark cover glass\n\n## Pin Configuration\n\n| Pin | Name | Type | Description |\n| --- | --- | --- | --- |\n| A1 | INT | I/O | Interrupt output, defaults to open drain (tristate), 47k pullup to IOVDD |\n| A2 | LPn | Input | Low-power mode control; drive low to disable I2C in LP mode, high to enable |\n| A3 | IOVDD | Power | 1.2 V or 1.8 V I/O supply |\n| A4 | SDA / MOSI | I/O | I2C: bidirectional data, 2.2k pullup to IOVDD; SPI: main output secondary input |\n| A5 | SCL / MCLK | Input | I2C: clock, 2.2k pullup to IOVDD; SPI: main clock |\n| A6 | RSVD1 | Reserved | Connect to ground |\n| A7 | RSVD2 | Reserved | Connect to ground |\n| B1 | SYNC | I/O | General purpose I/O, defaults to open drain (tristate), 47k pullup to IOVDD |\n| B4 | THERMALPAD | Ground | Connect to ground plane for thermal conduction |\n| B7 | CORE_1V8 | Power | 1.8 V analog core supply |\n| C1 | SPI_I2C_N | Input | I2C: low selects I2C mode, also serves as I2C reset pin; SPI: connect to IOVDD |\n| C2 | NCS | Input | I2C: not used, connect to GND with 47k pulldown; SPI: active low chip select |\n| C3 | GND | Ground | Ground |\n| C4 | AVDD | Power | 3.3 V analog and VCSEL supply |\n| C5 | MISO | Output | I2C: do not connect; SPI: main input secondary output, push-pull to IOVDD |\n| C6 | RSVD3 | Reserved | Connect to ground |\n| C7 | GND | Ground | Ground |\n\n## Absolute Maximum Ratings\n\n| Parameter | Min | Max | Unit |\n| --- | --- | --- | --- |\n| AVDD | -0.5 | 3.47 | V |\n| CORE_1V8 | -0.5 | 1.98 | V |\n| IOVDD | -0.5 | 1.98 | V |\n\n## Recommended Operating Conditions\n\n| Parameter | Min | Typ | Max | Unit |\n| --- | --- | --- | --- | --- |\n| AVDD supply | 3.13 | 3.3 | 3.47 | V |\n| CORE_1V8 supply | 1.62 | 1.8 | 1.98 | V |\n| IOVDD supply (1.2V config) | 1.08 | 1.2 | 1.32 | V |\n| IOVDD supply (1.8V config) | 1.62 | 1.8 | 1.98 | V |\n| Ambient temperature | -30 | -- | 85 | C |\n\n## Electrical Characteristics\n\n### Current Consumption\n\n| Device State | AVDD Typ | AVDD Max | CORE_1V8 Typ | CORE_1V8 Max | IOVDD Typ | IOVDD Max | Unit |\n| --- | --- | --- | --- | --- | --- | --- | --- |\n| LP idle | 55 | 390 | 0.01 | 0.5 | 0.5 | 2 | uA |\n| HP idle | 1 | 1.6 | 3 | 17 | 0.0003 | 0.002 | mA |\n| Active ranging | 43 | 50 | 50 | 80 | 0.003 | 0.006 | mA |\n\n### Typical Power Consumption\n\n| Mode | Power | Unit |\n| --- | --- | --- |\n| Continuous (4x4 or 8x8) | 215 | mW |\n| Autonomous 4x4, 1 Hz, 5 ms integration | 1.6 | mW |\n| Autonomous 4x4, 5 Hz, 5 ms integration | 12.5 | mW |\n| Autonomous 8x8, 1 Hz, 5 ms integration | 6.7 | mW |\n| Autonomous 8x8, 5 Hz, 5 ms integration | 32.3 | mW |\n\n### ESD Performance\n\n| Parameter | Specification | Conditions |\n| --- | --- | --- |\n| Human body model | JEDEC JS-001-2014 | +/- 2 kV, 1500 ohm, 100 pF |\n| Charged body model | JEDEC JS-001-2014 | +/- 500 V |\n\n## Power Domains\n\nThe VL53L8CX requires three independent power supplies:\n\n- **CORE_1V8:** 1.8 V analog core supply\n- **AVDD:** 3.3 V analog and VCSEL supply\n- **IOVDD:** 1.2 V or 1.8 V I/O supply (when 1.8 V, can share with CORE_1V8)\n\nAll three supplies should be applied and removed at the same time. Minimum slew rates must be met for proper power-on reset operation (AVDD: 0.001 V/us, CORE_1V8: 0.012 V/us, IOVDD: 0.012 V/us).\n\n## Communication Interface\n\n### I2C Interface\n\nThe I2C bus operates at up to 1 Mbit/s (fast mode plus) with a device 8-bit address of 0x52. Both SDA and SCL require pull-up resistors (2.2k ohm recommended). The interface supports autoincrement indexing with 16-bit register addresses.\n\n### SPI Interface\n\nThe SPI interface operates at up to 3 MHz using 4-wire configuration (NCS, MCLK, MOSI, MISO). Clock polarity = 1, clock phase = 1 (data captured on rising edge, propagated on falling edge). Address length is 15 bits, data length is 8 bits. Supports autoincrement read and write modes.\n\n## Software API\n\nThe host application controls the VL53L8CX through an API delivered as a C driver (and reference Linux driver). The driver provides high-level functions for device initialization, ranging start/stop, and mode select.\n\nThe device supports three power states:\n- **LP idle:** Low-power idle with data retention, RAM and registers preserved\n- **HP idle:** High-power idle, power-up state, required before starting ranging\n- **Ranging:** Full operation with VCSEL actively pulsing\n\nTransitions between states are controlled via I2C/SPI commands. Refer to UM3109 for detailed API usage.\n\n## Applications\n\n- Robotic applications: SLAM, wall tracking, small object detection, cliff prediction, floor recognition\n- System activation under ambient light for smart buildings and smart lighting\n- Content management for tanks, loads in trucks, and waste bins\n- Liquid level monitoring\n- Gesture recognition\n- Keystone correction for video projectors\n- Augmented reality/Virtual reality enhancement with dual camera stereoscopy\n- IoT and battery-powered devices for user and object detection\n- Laser assisted autofocus (LAF) for camera systems in low light or low contrast scenes\n\n## Packages\n\n| Order Code | Package | Packing | Min Order Qty |\n| --- | --- | --- | --- |\n| VL53L8CXV0GC/1 | Optical LGA16 with liner | Tape and reel | 3600 pcs |\n\n### Package Details\n\n- Body size: 6.4 x 3.0 x 1.75 mm\n- 16-pin land grid array (LGA) with thermal pad\n- Dual-source cap assemblies with identical pad and substrate design\n- Product marking: L8A-\n- Moisture sensitivity level: MSL 3 (IPC/JEDEC JSTD-020-C)\n- Storage temperature: -40 to 90 C\n- Maximum compression force: 25 N\n- Reflow: Pb-free convection reflow only (no vapor phase), peak 240 C recommended / 260 C max\n\n### Recommended Solder Profile\n\n| Parameter | Recommended | Maximum | Unit |\n| --- | --- | --- | --- |\n| Min preheat temp | 130 | 150 | C |\n| Max preheat temp | 200 | 200 | C |\n| Preheat time | 90-110 | 60-120 | s |\n| Liquidus temp | 217 | 217 | C |\n| Time above liquidus | 55-65 | 55-65 | s |\n| Peak temperature | 240 | 260 | C |\n| Time to peak | 300 | 300 | s |\n| Ramp down rate | -4 | -6 | C/s |\n",
  "author": {
    "id": "695820315b5f1e4db2fcf602",
    "name": "Kyle Bergstedt",
    "email": "[email protected]"
  },
  "visibility": {
    "public": true
  },
  "hero": null,
  "sample_prompts": [],
  "discovery_triggers": [],
  "discovery_pitch": null,
  "metadata": {},
  "created_at": "2026-05-28T05:36:57.949Z",
  "updated_at": "2026-05-28T05:36:57.949Z"
}