TSSOP-14 - page.json

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{
  "schema_version": 1,
  "type": "component",
  "slug": "tssop-14",
  "title": "TSSOP-14",
  "brief": "Thin Shrink Small Outline Package — 14-pin IC package with 0.65mm pitch",
  "version": "1.0.0",
  "tags": [],
  "license": "MIT",
  "component": {
    "mpn": "TSSOP-14",
    "manufacturer": "",
    "package": "",
    "pin_count": null,
    "category": "IC Package",
    "subcategory": "",
    "body_size": null,
    "parts": {},
    "distributor_links": {}
  },
  "readme": "# TSSOP-14\n\nThe TSSOP-14 (Thin Shrink Small Outline Package) is a popular 14-pin IC package with 0.65mm pitch. At 4.4 x 5mm body size, it offers significant board space savings over SOIC while remaining hand-solderable. Commonly used for op-amps (LM324, TL074), logic ICs (74HC series), motor drivers, ADCs, and small MCU peripherals. The thin profile (1.1mm max height) makes it ideal for space-constrained designs.",
  "author": {
    "id": "695820315b5f1e4db2fcf602",
    "name": "Kyle Bergstedt",
    "email": "[email protected]"
  },
  "visibility": {
    "public": true
  },
  "hero": null,
  "sample_prompts": [],
  "discovery_triggers": [],
  "discovery_pitch": null,
  "metadata": {},
  "created_at": "2026-05-28T05:36:09.265Z",
  "updated_at": "2026-05-28T05:36:09.265Z"
}