Description
The SiR680ADP is a high-performance N-channel 80 V power MOSFET from Vishay Siliconix in a PowerPAK SO-8 single package. Built on Vishay's TrenchFET Gen IV technology, it is optimized for the lowest RDS(on) x Qg and RDS(on) x Qoss figures of merit (FOM), making it ideal for synchronous rectification, primary-side switching, and DC-DC converter applications. The device delivers extremely low on-resistance (2.35 mOhm typical at VGS = 10 V) with a continuous drain current rating of 100 A at 25 C.
Features
- TrenchFET Gen IV power MOSFET technology
- Very low RDS(on): 2.35 mOhm typ at VGS = 10 V, ID = 20 A
- Low RDS(on) x Qg figure of merit
- Tuned for lowest RDS(on) x Qoss FOM
- 100% Rg and UIS tested
- Continuous drain current: 100 A (at 25 C case temperature)
- Drain-source voltage: 80 V
- Gate-source voltage: +/- 20 V
- PowerPAK SO-8 package (leadless, exposed copper pad)
- RoHS compliant, halogen-free
Pin Configuration
PowerPAK SO-8 Single configuration:
| Pin |
Function |
| 1 |
S (Source) |
| 2 |
S (Source) |
| 3 |
S (Source) |
| 4 |
G (Gate) |
| 5 |
D (Drain) |
| 6 |
D (Drain) |
| 7 |
D (Drain) |
| 8 |
D (Drain) |
| Exposed pad |
D (Drain) |
Absolute Maximum Ratings
TA = 25 C unless otherwise noted.
| Parameter |
Symbol |
Limit |
Unit |
| Drain-source voltage |
VDS |
80 |
V |
| Gate-source voltage |
VGS |
+/- 20 |
V |
| Continuous drain current (TC = 25 C) |
ID |
100 |
A |
| Continuous drain current (TC = 70 C) |
ID |
80.7 |
A |
| Continuous drain current (TA = 25 C) |
ID |
24.5 |
A |
| Pulsed drain current (t <= 100 us) |
IDM |
300 |
A |
| Continuous source-drain diode current |
IS |
5.6 |
A |
| Single pulse avalanche current (L = 0.1 mH) |
IAS |
80 |
mJ |
| Single pulse avalanche energy |
EAS |
104 |
mJ |
| Maximum power dissipation (TC = 25 C) |
PD |
125 |
W |
| Maximum power dissipation (TC = 70 C) |
PD |
68.6 |
W |
| Maximum power dissipation (TA = 25 C) |
PD |
6.25 |
W |
| Maximum power dissipation (TA = 70 C) |
PD |
4.1 |
W |
| Operating junction and storage temperature |
TJ, Tstg |
-55 to +150 |
C |
| Soldering recommendations (peak temperature) |
- |
260 |
C |
Thermal Information
| Parameter |
Symbol |
Typical |
Maximum |
Unit |
| Maximum junction-to-ambient (t <= 10 s) |
RthJA |
- |
20 |
C/W |
| Maximum junction-to-case (drain) steady state |
RthJC |
0.9 |
1.2 |
C/W |
Electrical Characteristics
TJ = 25 C unless otherwise noted.
Static
| Parameter |
Symbol |
Test Conditions |
Min |
Typ |
Max |
Unit |
| Drain-source breakdown voltage |
V(BR)DSS |
VGS = 0 V, ID = 1 mA |
80 |
-- |
-- |
V |
| VDS temperature coefficient |
dV(BR)/dT |
ID = 10 mA |
-- |
61 |
-- |
mV/C |
| V(BR)DSS temperature coefficient |
dV(BR)DSS/TJ |
ID = 250 uA |
-- |
-8.2 |
-- |
mV/C |
| Gate-source threshold voltage |
VGS(th) |
VDS = VGS, ID = 250 uA |
2 |
-- |
3.5 |
V |
| Gate-source leakage |
IGSS |
VGS = +/- 20 V |
-- |
-- |
100 |
nA |
| Zero gate voltage drain current |
IDSS |
VGS = 0 V |
-- |
-- |
1 |
uA |
| On-state drain current |
ID(on) |
VGS = 10 V, VDS = 0.1 V |
-- |
40 |
-- |
A |
| Drain-source on-resistance |
RDS(on) |
VGS = 10 V, ID = 20 A |
-- |
0.00235 |
0.00288 |
Ohm |
| Drain-source on-resistance |
RDS(on) |
VGS = 7.5 V, ID = 15 A |
-- |
0.00270 |
0.00350 |
Ohm |
| Forward transconductance |
gfs |
VDS = 15 V, ID = 20 A |
-- |
68 |
-- |
S |
Dynamic
| Parameter |
Symbol |
Test Conditions |
Min |
Typ |
Max |
Unit |
| Input capacitance |
Ciss |
VGS = 0 V, f = 1 MHz |
-- |
4415 |
-- |
pF |
| Output capacitance |
Coss |
VDS = 40 V |
-- |
614 |
-- |
pF |
| Reverse transfer capacitance |
Crss |
|
-- |
26 |
-- |
pF |
| Total gate charge |
Qg |
VDS = 40 V, ID = 20 A |
-- |
55 |
83 |
nC |
| Gate-source charge |
Qgs |
VGS = 10 V |
-- |
43 |
65 |
nC |
| Gate-drain charge |
Qgd |
|
-- |
17 |
-- |
nC |
| Gate resistance |
Rg |
f = 1 MHz |
0.3 |
0.88 |
1.5 |
Ohm |
| Turn-on delay time |
td(on) |
VDD = 40 V, RL = 2 Ohm |
-- |
17 |
34 |
ns |
| Rise time |
tr |
ID = 20 A, RG = 1 Ohm |
-- |
8 |
16 |
ns |
| Turn-off delay time |
td(off) |
|
-- |
30 |
60 |
ns |
| Fall time |
tf |
|
-- |
9 |
18 |
ns |
| Turn-on delay time |
td(on) |
VDD = 40 V, RL = 2 Ohm |
-- |
15 |
30 |
ns |
| Rise time |
tr |
RG = 7.5 V, RG = 1 Ohm |
-- |
9 |
18 |
ns |
| Turn-off delay time |
td(off) |
|
-- |
30 |
60 |
ns |
| Fall time |
tf |
|
-- |
9 |
18 |
ns |
Drain-Source Body Diode Characteristics
| Parameter |
Symbol |
Test Conditions |
Min |
Typ |
Max |
Unit |
| Continuous source-drain diode current |
IS |
TC = 25 C |
-- |
-- |
125 |
A |
| Pulse diode forward current |
ISM |
|
-- |
-- |
300 |
A |
| Body diode voltage |
VSD |
IS = 6 A, VGS = 0 V |
-- |
0.72 |
1.1 |
V |
| Body diode reverse recovery time |
trr |
|
-- |
53 |
106 |
ns |
| Body diode reverse recovery charge |
Qrr |
IF = 20 A, di/dt = 100 A/us |
-- |
70 |
140 |
nC |
| Reverse recovery fall time |
ta |
TJ = 25 C |
-- |
30 |
-- |
ns |
| Reverse recovery rise time |
tb |
|
-- |
23 |
-- |
ns |
Packages
Ordering Information
| Part Number |
Package |
Notes |
| SiR680ADP-T1-RE3 |
PowerPAK SO-8 |
Lead (Pb)-free and halogen-free |
| SiR680ADP-T1-GE3 |
PowerPAK SO-8 |
Lead (Pb)-free and halogen-free, BLR on ICL |
| SiR680ADP-T1-BE3 |
PowerPAK SO-8 |
Alternate manufacturing location |
PowerPAK SO-8 Dimensions
Body: 5.05-5.26 mm (D) x 6.09-6.25 mm (E). Height: 0.97-1.12 mm (A). Lead pitch: 1.27 BSC mm. Exposed pad dimensions: 3.56-3.91 mm (D2) x 3.48-3.84 mm (E2).
Applications
- Synchronous rectification
- Primary side switching
- DC-DC converters
- OR-ing
- Power supplies
- Motor drive control
- Battery and load switch