QFN-20-1EP

{
  "schema_version": 1,
  "type": "component",
  "slug": "qfn-20-1ep",
  "title": "QFN-20-1EP",
  "brief": "Quad Flat No-lead — 20-pin leadless package with exposed thermal pad",
  "version": "1.0.0",
  "tags": [],
  "license": "MIT",
  "component": {
    "mpn": "QFN-20-1EP",
    "manufacturer": "",
    "package": "",
    "pin_count": null,
    "category": "IC Package",
    "subcategory": "",
    "body_size": null,
    "parts": {},
    "distributor_links": {}
  },
  "readme": "# QFN-20-1EP\n\nThe QFN-20-1EP is a modern 20-pin Quad Flat No-lead package with an exposed thermal pad. The leadless design (4 x 4mm body, 0.5mm pitch) provides smaller footprint than equivalent leaded packages while offering superior thermal and electrical performance through the exposed pad. The 2.5 x 2.5mm thermal pad provides excellent heat dissipation. Used for sensor ICs, small microcontrollers, RF transceivers, and power management chips.",
  "author": {
    "id": "695820315b5f1e4db2fcf602",
    "name": "Kyle Bergstedt",
    "email": "[email protected]"
  },
  "visibility": {
    "public": true
  },
  "hero": null,
  "sample_prompts": [],
  "discovery_triggers": [],
  "discovery_pitch": null,
  "metadata": {},
  "created_at": "2026-05-28T05:35:54.835Z",
  "updated_at": "2026-05-28T05:35:54.835Z"
}