DFN-8-1EP (3x2mm)

{
  "schema_version": 1,
  "type": "component",
  "slug": "dfn-8-1ep",
  "title": "DFN-8-1EP (3x2mm)",
  "brief": "Dual Flat No-lead — ultra-compact 8-pin leadless package with exposed pad",
  "version": "1.0.0",
  "tags": [],
  "license": "MIT",
  "component": {
    "mpn": "DFN-8-1EP (3x2mm)",
    "manufacturer": "",
    "package": "",
    "pin_count": null,
    "category": "IC Package",
    "subcategory": "",
    "body_size": null,
    "parts": {},
    "distributor_links": {}
  },
  "readme": "# DFN-8-1EP (3x2mm)\n\nThe DFN-8-1EP is an ultra-compact 8-pin Dual Flat No-lead package measuring just 3 x 2mm. With no leads protruding from the body and a 1.36 x 1.46mm exposed thermal pad, it offers the smallest possible footprint for 8-pin ICs. Used for precision voltage references (REF3030), low-noise LDOs, temperature sensors (TMP117), and small sensor ICs. The leadless design provides excellent electrical performance with very low parasitic inductance, important for high-frequency and precision analog circuits.",
  "author": {
    "id": "695820315b5f1e4db2fcf602",
    "name": "Kyle Bergstedt",
    "email": "[email protected]"
  },
  "visibility": {
    "public": true
  },
  "hero": null,
  "sample_prompts": [],
  "discovery_triggers": [],
  "discovery_pitch": null,
  "metadata": {},
  "created_at": "2026-05-28T05:35:45.019Z",
  "updated_at": "2026-05-28T05:35:45.019Z"
}