TO-263 (D2PAK)

{
  "schema_version": 1,
  "type": "component",
  "slug": "3d-to-263",
  "title": "TO-263 (D2PAK)",
  "brief": "Large surface-mount power package — high-current MOSFETs and regulators",
  "version": "1.0.0",
  "tags": [],
  "license": "MIT",
  "component": {
    "mpn": "TO-263 (D2PAK)",
    "manufacturer": "",
    "package": "",
    "pin_count": null,
    "category": "Power Package",
    "subcategory": "",
    "body_size": null,
    "parts": {},
    "distributor_links": {}
  },
  "readme": "# TO-263 (D2PAK)\n\nThe TO-263 (D2PAK) is the surface-mount version of TO-220 for high-power applications. At 10 x 9mm with a massive thermal tab, it dissipates up to 2-3W without heatsinking and much more with PCB copper pour thermal relief. Houses high-current MOSFETs (IRF3205S), high-power voltage regulators, and power Schottky diodes. Roughly 50% larger than DPAK (TO-252), it handles higher thermal loads. The 3D model shows the large body, wide thermal tab, and two signal leads.",
  "author": {
    "id": "695820315b5f1e4db2fcf602",
    "name": "Kyle Bergstedt",
    "email": "[email protected]"
  },
  "visibility": {
    "public": true
  },
  "hero": null,
  "sample_prompts": [],
  "discovery_triggers": [],
  "discovery_pitch": null,
  "metadata": {},
  "created_at": "2026-05-28T05:36:41.531Z",
  "updated_at": "2026-05-28T05:36:41.531Z"
}