TO-247-3

{
  "schema_version": 1,
  "type": "component",
  "slug": "3d-to-247",
  "title": "TO-247-3",
  "brief": "High-power through-hole package — IGBTs, large MOSFETs, and power modules",
  "version": "1.0.0",
  "tags": [],
  "license": "MIT",
  "component": {
    "mpn": "TO-247-3",
    "manufacturer": "",
    "package": "",
    "pin_count": null,
    "category": "Power Package",
    "subcategory": "",
    "body_size": null,
    "parts": {},
    "distributor_links": {}
  },
  "readme": "# TO-247-3\n\nThe TO-247 is the largest common through-hole power semiconductor package. With a massive metal tab and 21 x 16mm body, it dissipates up to 200W with a proper heatsink. Three leads at 5.45mm pitch carry high-current paths for IGBTs (IRG4PC50W), power MOSFETs (IRFP250N), and SiC diodes. The mounting hole accepts M3 screws for heatsink attachment. The 3D model shows the large metal backing plate, plastic body, and heavy-gauge leads.",
  "author": {
    "id": "695820315b5f1e4db2fcf602",
    "name": "Kyle Bergstedt",
    "email": "[email protected]"
  },
  "visibility": {
    "public": true
  },
  "hero": null,
  "sample_prompts": [],
  "discovery_triggers": [],
  "discovery_pitch": null,
  "metadata": {},
  "created_at": "2026-05-28T05:36:40.206Z",
  "updated_at": "2026-05-28T05:36:40.206Z"
}