component
RS3B-13-F
Public Made by Adomby adom
Diodes Incorporated Diodes - General Purpose, SMC. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownRS3B-13-F
Diodes Incorporated · Diodes - General Purpose · SMC
RS3B-13-F from Diodes Incorporated, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SMC |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage | VRRM/VRWM/VR | 100 | V | RS3B column | 1 | ||
| RMS Reverse Voltage | VR(RMS) | 70 | V | RS3B column | 1 | ||
| Average Rectified Output Current | IO | 3 | A | @ TT = 75C | 1 | ||
| Non-Repetitive Peak Forward Surge Current | IFSM | 100 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC method) | 1 | ||
| Forward Voltage | VFM | 1.3 | V | IF = 3.0A | 1 | ||
| Peak Reverse Current | IRM | 5 | µA | TA = 25C, at rated DC blocking voltage | 1 | ||
| Peak Reverse Current | IRM | 250 | µA | TA = 125C, at rated DC blocking voltage | 1 | ||
| Operating and Storage Temperature Range | Tj, TSTG | -65 | 150 | C | 1 | ||
| Typical Junction Capacitance | Cj | 50 | pF | 1.0MHz, applied reverse voltage 4.0V DC | 1 | ||
| Typical Thermal Resistance Junction to Terminal | RθJT | 25 | K/W | mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | Notes: 1. Thermal resistance: junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink. | 1 |
CAD (KiCad official)
- Symbol:
RS3B-13-F - Footprint:
Diode_SMD:D_SMC - 3D model: SMC (KiCad packages3D, STEP)
- 3D model files:
rs3b-13-f-etched.step/rs3b-13-f-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs3b-13-f.step/rs3b-13-f.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (2 pp, sha256
83bc05be074fed42, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).